Kit of 3 NAND positioning templates for Blue&Me ARM STA2062A and Xilinx XC3S400
Original price was: 117,00 €.99,45 €Current price is: 99,45 €. VAT ExcI.
BeM FIX kit consisting of 3 stainless steel positioning templates for NAND memories used in Blue&Me units with ARM STA2062A processor and Xilinx XC3S400 platform.
Purchasing the complete kit gives you a 15% discount compared to buying the three templates separately.
The kit covers 9 × 11 mm and 10.5 × 13 mm packages and is compatible with Micron NQ278, NW190, NW140 and Samsung K9F1G08R0B and K9F5608U0D memories.
In stock (can be backordered)
In stock (can be backordered)
In stock (can be backordered)
| Weight | 0,1 kg |
|---|---|
| Dimensions | 9 × 6 × 2 cm |
In stock (can be backordered)
Complete NAND positioning template kit for Blue&Me
The BeM FIX kit includes the three positioning templates required to work on the main NAND configurations used in Blue&Me units based on ARM STA2062A and Xilinx XC3S400.
The templates help ensure correct memory alignment on the PCB during replacement and rework operations, reducing the risk of incorrect positioning.
Kit value
The kit is offered with a 15% discount compared to purchasing the three stencils separately.
It is the most cost-effective solution for anyone who needs all the stencils required to work on the main NAND configurations of Blue&Me ARM STA2062A and Xilinx XC3S400 units.
Stencils included
| Code | Platform | Compatible memories | Size |
|---|---|---|---|
| BEMFIX-DIM-001 | ARM STA2062A | Micron NQ278, Micron NW190, Samsung K9F1G08R0B | 9 × 11 mm |
| BEMFIX-DIM-002 | ARM STA2062A | Micron NW140 | 10.5 × 13 mm |
| BEMFIX-DIM-003 | Xilinx XC3S400 | Samsung K9F5608U0D | 9 × 11 mm |
Compatibility
The kit is designed for the following NAND memories:
- Micron NQ278;
- Micron NW190;
- Micron NW140;
- Samsung K9F1G08R0B;
- Samsung K9F5608U0D.
The stencils are intended for work on Blue&Me units based on:
- ARM STA2062A processor;
- Xilinx XC3S400 FPGA.
Before use, always check the full memory code, package dimensions, and circuit board configuration.
Stainless steel construction
The templates are made of stainless steel and designed for professional use in microsoldering and rework operations.
Key features include:
- antimagnetic properties;
- acid resistance;
- good dimensional stability;
- resistance to products used during rework;
- repeated use capability.
Applications
The kit can be used during:
- NAND memory replacement;
- Blue&Me unit repair;
- component positioning before soldering;
- BGA rework;
- memory realignment on the circuit board.
How to use
Select the template corresponding to the memory and the dimensions of the installed package.
Place the template on the circuit board, insert the component into the opening, and carefully check its orientation before proceeding with soldering.
The templates only facilitate positioning and do not replace proper cleaning, preparation, reballing, and soldering procedures for the component.
Technical specifications
| Feature | Value |
| Kit code | BEMFIX-DIM-KIT |
| Number of stencils | 3 |
| Application | Blue&Me units |
| Supported platforms | ARM STA2062A, Xilinx XC3S400 |
| Supported sizes | 9 × 11 mm, 10.5 × 13 mm |
| Material | Stainless steel |
| Properties | Antimagnetic, acid-resistant |
| Use | NAND positioning during rework |
Package contents
| Component | Quantity |
| BEMFIX-DIM-001 stencil for 9 × 11 mm NAND | 1 |
| BEMFIX-DIM-002 template for 10.5 × 13 mm NAND | 1 |
| BEMFIX-DIM-003 template for 9 × 11 mm NAND | 1 |
Important Information
The product includes only the three positioning templates.
NAND memories, Blue&Me units, and any tools shown in the images are not included.
Before soldering, always check the correct orientation of pin 1 on the memory.
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