Universal BGA reballing fixture with magnetic clamps

Universal BGA reballing fixture

The fixture is designed to facilitate reballing operations on BGA, NAND, eMMC, GPU, chipset, and other compatible electronic components.

The aluminum alloy structure ensures lightness, rigidity, and stability during component positioning and solder ball application.

Four-point automatic centering

The system uses a spiral rotating plate that simultaneously actuates the four clamping points.

By rotating the central control, the clamps move uniformly inward and automatically center the chip, without the need to adjust each clamping point separately.

This solution enables:

• rapid component centering;
• uniform pressure on all four sides;
• greater positioning precision;
• reduced setup time;
• stable clamping during reballing.

Magnetic stencil locking

The stencil is secured via magnetic clamps and does not require screws.

The system allows for rapid installation and removal of the stencil, simplifying transitions between different components and operations.

The fixture is compatible with stencils in the following sizes:

• 80 × 80 mm;
• 90 × 90 mm.

Stencil height adjustment

Dedicated adjusters for height regulation are located near the corners.

These allow adaptation of the stencil position to the chip thickness and ensure proper contact with the component surface during paste or solder ball application.

Wide clamping range

The clamping system allows working with components of different sizes:

Before processing, verify that the component shape allows stable clamping on all four sides.

Aluminum alloy structure

The structure is made of aluminum alloy, chosen to provide:

• good rigidity;
• low weight;
• resistance to frequent use;
• stability during reballing operations;
• ease of cleaning.

Applications

The fixture can be used for reballing:

• NAND Flash memories;
• eMMC memories;
• BGA chips;
• GPUs and chipsets;
• compatible processors and microcontrollers;
• components used in automotive ECUs;
• integrated circuits from electronic boards.

Operating procedure

1. Position the chip at the center of the fixture.
2. Rotate the control to simultaneously move the four clamps inward.
3. Verify that the component is centered and properly secured.
4. Install the stencil of the appropriate size.
5. Lock the stencil using the magnetic clamps.
6. Adjust the height using the adjusters located near the corners.
7. Proceed with solder paste or ball application and subsequent heating.

Watch the reballing tutorial

Technical specifications

Package contents

Stencils, chips, solder balls, solder paste, and heating equipment are not included.

Important Information

Before proceeding with heating, verify that the chip is properly centered, that the stencil is stable, and that the height is uniformly adjusted.

The fixture facilitates positioning and reballing but does not replace proper component preparation, stencil selection, thermal profile, and appropriate soldering procedures.