VFBGA63 Reballing Stencil for HTX90 Support, 0.25 mm

VFBGA63 Stencil for BGA Reballing

The BeM FIX BEMFIX-STNL-VFBGA63 stencil is designed for reballing components and memories in VFBGA63 package.

It allows correct distribution and positioning of solder balls on the component matrix, facilitating the restoration of BGA connections during repair and rework operations.

Compatible with HTX90 Support

The stencil is designed to be used with the SLD-AID-HTX90 universal BGA reballing support.

The support’s magnetic fastening system allows the stencil to be quickly locked without using screws, keeping it correctly aligned with the component.

High-Precision Laser Production

The stencil openings are made using laser processing with high dimensional accuracy.

This process allows:

• regular and uniform holes;
• correct positioning of the balls;
• high repeatability of operations;
• greater precision during reballing;
• better distribution of paste or solder balls.

Stainless Steel Structure

The stencil is made of stainless steel with a thickness of 0.25 mm.

The material offers:

• acid resistance;
• good dimensional stability;
• resistance to products used during rework;
• ease of cleaning;
• possibility of repeated use.

Applications

The stencil can be used for:

• reballing VFBGA63 memories;
• repair of Blue&Me units;
• restoration of solder balls;
• replacement of NAND Flash memories;
• microsoldering and BGA rework operations.

Instructions for Use

1. Position the component in the HTX90 support.
2. Center and lock the chip using the four clamps.
3. Position the stencil over the component.
4. Lock the stencil using the magnetic supports.
5. Adjust the height so that the stencil adheres correctly to the chip surface.
6. Apply the balls or solder paste.
7. Carefully remove the stencil and proceed with heating.

Watch the reballing tutorial

Technical Specifications

Important Information

The product includes the stencil only.

The HTX90 support, BGA component, solder balls, flux, and other equipment possibly shown in the images are not included.

Before use, verify that the component’s ball layout corresponds exactly to the stencil matrix.