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Complete VFBGA63 reballing kit with MINIWARE MHP30, HTX90 support, BGA63 stencil, and consumables.
Complete VFBGA63 reballing kit with Mini Hot Plate Original price was: 389,30 €.Current price is: 338,00 €. VAT ExcI.

MINIWARE MHP50 Mini Hot Plate – Preheating Station with 100 W PD Power Supply

Price range: 189,00 € through 289,00 € VAT ExcI.

MINIWARE MHP50 Mini Hot Plate is a portable preheating station with a 50 × 50 mm heating area, adjustable temperature from 100 °C to 350 °C and BS50 brass plate with nanoceramic coating.

Supports USB-C Power Delivery up to 100 W and DC5525 power up to 150 W. Available with 100 W USB-C PD power supply included or without power supply.

Weight0,8 kg
Dimensions15 × 12 × 5 cm
Power SupplyWith PD Power Supply, Without PD Power Supply
Description

MINIWARE MHP50 was developed as an evolution of the MHP30 and offers a larger heating surface, greater power and more advanced thermal management.

Despite the 50 × 50 mm heating area, it maintains compact dimensions and can be used both in the laboratory and for off-site technical work.

It is suitable for preheating, soldering, desoldering, reflow and rework of printed circuit boards and electronic components.

50 × 50 mm Heating Area

The BS50 plate offers a usable surface of 50 × 50 mm, larger than the MHP30 plate.

It is suitable for:

  • small and medium-sized printed circuit boards;
  • NAND and eMMC memories;
  • BGA components;
  • electronic modules;
  • LEDs and compact boards;
  • SMD soldering and desoldering work.

BS50 Brass Plate

MHP50 is equipped with the BS50 heating plate, made of brass with nanoceramic coating.

The smooth surface promotes uniform heat transfer and facilitates the positioning of components or boards to be worked on.

The plate is separable from the controller and can be replaced with compatible modules.

Dual Power Mode

Depending on the selected variant, the package may include a 100 W USB-C Power Delivery power supply.

InputSpecifications
USB-C Power Delivery20 V, up to 100 W
DC552519–24 V, up to 150 W

Use only one power input at a time.

The package offered includes a 100 W USB-C Power Delivery power supply.

Rapid Heating

With adequate power supply, the plate can reach 300 °C from an ambient temperature of approximately 28 °C in approximately 150 seconds. Actual time may vary depending on the power supply, cable, ambient temperature and thermal dissipation.

Adjustable Temperature

The operating temperature can be adjusted from 100 °C to 350 °C.

The declared stability is ±3%, allowing a controlled temperature to be maintained during preheating and rework operations.

Separable Controller

The controller and heating plate are separable.

This configuration allows:

  • rapid plate replacement;
  • easier transport;
  • reduced heat transfer to the controller;
  • simplified maintenance and cleaning;
  • use of compatible accessories.

Color Display and Physical Controls

The controller integrates a color display showing set temperature, detected temperature, power and main operating parameters.

Physical controls allow rapid temperature adjustment and access to available settings.

A light indicator varies according to temperature, facilitating recognition of the plate’s thermal state.

Programmable Heating Curve

MHP50 allows thermal curves to be set divided into multiple phases, specifying temperature and duration.

This function allows a profile similar to a reflow process to be reproduced for small boards and compatible components.

Available functions may vary depending on the installed firmware version.

Controller Cooling

The controller integrates a cooling system that helps limit thermal transfer from the plate.

The separate structure and internal deflector protect the electronic section during high-temperature operations.

Applications

MINIWARE MHP50 can be used for:

  • preheating printed circuit boards;
  • SMD soldering and desoldering;
  • reflow of small PCBs;
  • preheating and thermal support during removal of NAND and eMMC memories;
  • support for rework operations on BGA components.
  • preheating during hot air use;
  • work on automotive modules;
  • repair of smartphones and electronic devices;
  • removal of LEDs and plate-mounted components.

Original MINIWARE Product

The product supplied is an original MINIWARE MHP50.

Use of the original product ensures correct compatibility with firmware, accessories and heating plates provided by the manufacturer.

Safety Warnings

The plate surface can reach temperatures up to 350 °C.

Do not touch the plate, metal bracket or heated components during use and after switching off.

Do not connect the USB-C PD input and DC5525 input simultaneously.

Do not remove or replace the plate while the device is powered or still hot.

Use the station in a ventilated environment, on a fireproof surface and away from flammable materials.

Do not leave the device switched on and unattended.

SpecificationValue
Product CodeSLD-AID-MHP002/ SLD-AID-MHP002PD
ModelMINIWARE MHP50
Plate ModelBS50
Plate MaterialBrass with nanoceramic coating
Heating Area50 × 50 mm
Temperature Range100–350 °C
Temperature Stability±3%
Maximum USB-C PD Power100 W
Maximum DC5525 Power150 W
USB-C InputPD 20 V
DC Input19–24 V
DC ConnectorDC5525
Test Ambient TemperatureApproximately 28 °C
Tip to Ground ResistanceLess than 2 Ω
DisplayColor display
Upgradeable FirmwareYes

Dimensions and Weight

ComponentDimensions / weight
Controller71.5 × 55.5 × 22.5 mm
BS50 Plate50 × 50 × 29 mm
Controller Weight78 g
BS50 Plate Weight87 g
Total Weight165 g

Package Contents

ComponentWith power supplyWithout power supply
MINIWARE MHP50 Controller11
BS50 brass heating plate with nanoceramic coating11
USB Type-C / Type-C cable11
100 W USB-C Power Delivery power supply10
Safety instructions11

Operating Instructions

  1. Place the station on a flat, stable and heat-resistant surface.
  2. Connect the device to a compatible USB-C Power Delivery power supply or to a compatible DC power supply, using only one input at a time.
  3. Connect the USB-C cable to the 100 W PD power supply.
  4. Set the desired temperature or thermal curve.
  5. Wait for the temperature to be reached.
  6. Place the board or component on the plate using appropriate tools.
  7. After completing the work, switch off the station.
  8. Wait for complete cooling before touching or removing the plate.

The station includes several configurable functions:

  • preset temperature;
  • tilt protection;
  • automatic power-on;
  • automatic sleep;
  • upgradeable firmware
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