NAND positioning template Micron NQ278 / NW190 and Samsung K9F1G08R0B, 9 × 11 mm

39,00 € VAT ExcI.

Stainless steel BeM FIX template for the correct positioning of Micron NQ278, Micron NW190, and Samsung K9F1G08R0B NAND memories in 9 × 11 mm packages.

Made of anti-magnetic and acid-resistant material, it is designed for rework operations on Blue&Me units based on the ARM STA2062A processor.

Weight0,05 kg
Dimensions9 × 6 × 2 cm

In stock (can be backordered)

Description

NAND positioning template for Blue&Me

The BeM FIX BEMFIX-DIM-001 template allows for the correct positioning of NAND memories used in Blue&Me units based on the ARM STA2062A processor.

It is compatible with Micron NQ278, Micron NW190, and Samsung K9F1G08R0B memories in the 9 × 11 mm format.

The template facilitates component alignment on the PCB during replacement and resoldering operations, reducing the risk of incorrect positioning.

Compatibility

The template is designed for:

  • Micron NQ278;
  • Micron NW190;
  • Samsung K9F1G08R0B;
  • 9 × 11 mm NAND package;
  • Blue&Me units with ARM STA2062A processor.

Compatibility must be verified based on the memory model, package dimensions, and PCB configuration.

Stainless steel structure

The template is made of stainless steel, a material suitable for laboratory use due to its resistance and stability.

Material features include:

  • anti-magnetic properties;
  • acid resistance;
  • good resistance to products used during electronic processing;
  • thin and precise structure;
  • reusability.

Applications

The template can be used during:

  • NAND memory replacement;
  • component positioning before soldering;
  • Blue&Me ECU repair;
  • BGA rework;
  • memory alignment on the PCB.

Instructions for use

Place the template on the PCB, matching the outline with the NAND memory seat.

Insert the component into the opening and verify its orientation before proceeding with soldering.

The template is intended solely for component positioning and does not replace correct memory preparation, reballing, and soldering procedures.

Watch the tutorial on YouTube

Technical specifications

Feature Value
Product code BEMFIX-DIM-001
Application Blue&Me units
Associated processor ARM STA2062A
Compatible memories Micron NQ278, Micron NW190, Samsung K9F1G08R0B
Package size 9 × 11 mm
Material Stainless steel
Properties Anti-magnetic, acid-resistant
Use NAND positioning during rework

Important Information

The product includes the positioning template only.

The NAND memory, Blue&Me board, and any tools shown in the images are not included.

Always verify the correct orientation of memory pin 1 before soldering.

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