Complete VFBGA63 reballing kit with Mini Hot Plate

The kit includes the equipment and main consumables required to perform reballing on memories and devices in VFBGA63 packages.

It is a complete solution for electronics laboratories, automotive technicians, and specialized operators seeking a compact, ready-to-use station for preparing and restoring BGA connections.

Original MINIWARE MHP30 included

The kit includes the original MINIWARE MHP30 preheating station, featuring a 30 × 30 mm heating plate and adjustable temperature from 100 °C to 350 °C.

The USB-C Power Delivery and compact dimensions allow the station to be used both in the laboratory and for off-site technical interventions.

With the included 65 W PD power supply, the plate reaches 300 °C in approximately 150 seconds, starting from an ambient temperature of about 26 °C.

HTX90 universal support

The HTX90 support allows for component centering via four synchronized locking points.

The spiral rotating plate moves the clamps simultaneously, eliminating the need for individual adjustment and allowing for quick, uniform clamping.

The support is compatible with components from 4 × 4 mm up to 45 × 45 mm.

Magnetic stencil fixing

The stencil is locked using magnetic clamps, without the use of screws.

The adjustment knobs located near the corners allow for the regulation of the stencil height relative to the component surface, facilitating correct ball positioning.

The HTX90 support can use 80 × 80 mm and 90 × 90 mm stencils.

Dedicated VFBGA63 stencil

The kit includes the BEMFIX-STNL-VFBGA63 stencil, made of stainless steel using high-precision laser processing.

The 0.25 mm thickness and dedicated matrix allow for the correct distribution of solder balls on compatible VFBGA63 devices.

Before processing, it is necessary to verify that the component’s ball layout exactly matches the stencil matrix.

Consumables included

The kit also includes the main consumables needed to prepare the component and perform the process:

• flux syringe;
• solder balls;
• high-temperature resistant polyimide tape;
• desoldering wick;
• precision tweezers.

The composition allows you to start working without having to purchase essential materials separately.

Applications

The kit can be used for:

• VFBGA63 memory reballing;
• restoration of BGA connections;
• NAND Flash memory processing;
• Blue&Me unit repair;
• electronic component rework;
• preparation of previously desoldered memories;
• soldering and desoldering of small SMD components;
• preheating of compact printed circuit boards.

Kit composition

MINIWARE MHP30 Specifications

HTX90 Support Specifications

General Operating Procedure

1. Thoroughly clean the component and remove solder residues.
2. Lock the component in the HTX90 support.
3. Select and position the VFBGA63 stencil.
4. Adjust the stencil height using the adjustment knobs.
5. Apply flux and distribute the solder balls.
6. Remove excess balls and verify the correct filling of the matrix.
7. Heat the component using the MINIWARE MHP30.
8. Wait for complete melting and correct settling of the balls.
9. Allow the component to cool without moving it.
10. Remove the stencil and check the result under a microscope.

Video tutorial

Watch the short tutorial dedicated to the reballing procedure:

Watch the 5-minute reballing tutorial

Original MINIWARE product

The preheating station included in the kit is an original MINIWARE MHP30.

The original product guarantees correct compatibility with firmware updates, accessories, and the technical specifications declared by the manufacturer.

Safety Warnings

The kit is intended for operators with experience in micro-soldering and BGA rework.

The heating plate can reach a temperature of 350 °C. Do not touch the surface, the metal bracket, or the component during processing and before complete cooling.

Use the kit in a ventilated environment, on a fireproof surface, and away from flammable materials.

Do not leave the station powered and unattended.

Before processing, always verify the compatibility between the component, stencil, ball diameter, and the thermal profile used.