NO CLEAN SD desoldering wick 0.8mm 3m
10,00 € VAT ExcI.
NO CLEAN SD desoldering wick in oxygen-free pure copper, width 0.8 mm / 0.030″, length 3 m / 10 ft. Ideal for removing excess solder from PCBs, SMD pads, memories, microcontrollers, and small components.
| Weight | 0,01 kg |
|---|---|
| Dimensions | 4 × 4 × 1 cm |
| FLT-Soldering-Product Typ | Desoldering Braid |
| FLT-Lead Free | Yes |
| FLT-Soldering-Flux | No-Clean |
| FLT-Package | Coil |
| FLT-Size | 0.8mm (0.03'') |
| FLT-Quantity | 3m (10') |
In stock (can be backordered)
The 0.8 mm NO CLEAN SD desoldering wick is designed for rapid and controlled removal of excess solder from printed circuit boards and electronic components.
The 0.8 mm / 0.030″ size, corresponding to Size #1, is particularly suitable for precision work on small SMD components, memory pads, microcontrollers, and areas where solder removal is required without affecting adjacent zones.
The braid is made of pure oxygen-free copper and uses a non-corrosive, halide-free, organic-based NO CLEAN SD flux technology. This formulation enables effective desoldering, reducing harmful residues and leaving the PCB clean and ready for component repositioning or new soldering.
The braid’s low-mass construction and high thermal conductivity provide a fast response even at lower temperatures, limiting the risk of overheating and damage to the printed circuit board.
Perfect for:
- Removing excess solder from PCBs
- SMD pad cleaning
- Memories and microcontrollers
- Small electronic components
- Precision rework and repairs
- Preparing the PCB before component repositioning
- Fast desoldering with reduced risk of overheating
- Electronics labs and technical service centers
| Feature | Description |
|---|---|
| Product code | SLD-SLW-001 |
| Product type | Desoldering braid |
| Technology | NO CLEAN SD |
| Size | Size #1 |
| Wick width | 0.76 mm / 0.030″ |
| Length | 3.048 m / 10 ft |
| Material | Pure oxygen-free copper |
| Flux type | Organic no-clean, non-corrosive, and halide-free |
| ANSI/IPC J-STD-004 classification | ROL0 |
| Residues | Reduced, suitable for no-clean processes |
| Recommended applications | Solder removal from PCBs, SMD pads, memories, microcontrollers, and small components |
| Main advantage | Rapid and controlled desoldering with reduced risk of PCB overheating |
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