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227 g spool of SAC305 lead-free solder wire, 0.5 mm diameter

SAC305 Lead-Free Solder Wire – 2.2% RA Flux – Ø 0.5 mm – 227 g

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Available on backorder

60,00 € VAT ExcI.

Lead-free solder wire made from SAC305 tin/silver/copper alloy (Sn96.5/Ag3.0/Cu0.5), with a diameter of 0.5 mm and a 2.2% rosin-activated (RA) flux core. Melting range: 217–220 °C. Supplied on a 227 g spool.

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454 g spool of SAC305 lead-free solder wire, 0.5 mm diameter

SAC305 Lead-Free Solder Wire – 2.2% RA Flux – Ø 0.5 mm – 454 g

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Available on backorder

114,80 € VAT ExcI.

Bobina di filo per saldatura Lead Free in lega Stagno/Argento/Rame SAC305 Sn96.5Ag3Cu0.5, diametro 0,5 mm, con flussante interno RA Rosin Activated al 2,2%. Punto di fusione 217–220 °C, peso 454 g.

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200 g spool of LowTemp Sn42Bi57Ag1 lead-free solder wire with 2.2% RA flux, 1.0 mm diameter

LowTemp Sn42/Bi57/Ag1 Lead-Free Solder Wire – 2.2% RA Flux – Ø 1.0 mm – 200 g

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Available on backorder

180,10 € VAT ExcI.

LowTemp lead-free solder wire made from Sn42/Bi57/Ag1 alloy, with a diameter of 1.0 mm and a 2.2% no-clean rosin-activated (RA) flux core. Melting point: 138 °C. Supplied on a 200 g spool. Ideal for rework and low-temperature soldering.

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200 g spool of LowTemp Sn42Bi57Ag1 lead-free solder wire, 1.0 mm diameter

LowTemp Sn42/Bi57/Ag1 Lead-Free Solder Wire – 2.5% WW Flux – Ø 1.0 mm – 200 g

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Available on backorder

184,60 € VAT ExcI.

LowTemp lead-free solder wire made from Sn42/Bi57/Ag1 alloy, with a diameter of 1.0 mm and a 2.5% No-Clean Water-Washable flux core. Melting point: 138 °C. Supplied on a 200 g spool. Ideal for rework and low-temperature soldering.

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Sn63Pb37 tin/lead solder wire spool Ø 0.5 mm, RA 2.2% flux, 113.5 g

Sn63Pb37 Tin/Lead Solder Wire Spool – RA 2.2% – Ø 0.5 mm – 113.5 g

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In stock

12,10 € VAT ExcI.

Tin/lead Sn63Pb37 solder wire spool, Ø 0.5 mm, with 2.2% rosin-activated (RA) flux core. Eutectic alloy with a melting point of 183 °C. Spool weight: 113.5 g. Ideal for professional electronics soldering and PCB rework.

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Sn63Pb37 tin/lead solder wire spool Ø 0.5 mm, RA 2.2% flux, 227 g

Sn63Pb37 Tin/Lead Solder Wire Spool – RA 2.2% – Ø 0.5 mm – 227 g

,

Available on backorder

25,70 € VAT ExcI.

Tin/lead Sn63Pb37 solder wire spool, Ø 0.5 mm, with 2.2% rosin-activated (RA) flux core. Eutectic alloy with a melting point of 183 °C. Spool weight: 227 g / 1/2 lb. Ideal for professional electronics soldering and PCB rework.

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Sn63Pb37 tin/lead solder wire spool Ø 0.5 mm, RA 2.2% flux, 454 g

Sn63Pb37 Tin/Lead Solder Wire Spool – RA 2.2% – Ø 0.5 mm – 454 g

,

Available on backorder

35,00 € VAT ExcI.

Tin/lead Sn63Pb37 solder wire spool, Ø 0.5 mm, with 2.2% rosin-activated (RA) flux core. Eutectic alloy with a melting point of 183 °C. Spool weight: 454 g / 1 lb. Ideal for professional electronics soldering and PCB rework.

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MagicAlloy Lead Free low melting point alloy 79–91 °C for SMD component removal

MagicAlloy Lead Free alloy for SMD removal 79–91°C

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In stock

31,60 € VAT ExcI.

Low melting point lead-free alloy for SMD component removal. Melts at 79–91 °C and enables desoldering of electronic components while reducing the risk of damage to PCBs and SMD parts. Supplied in 9 filaments of 15 cm, for a total of 1.35 m.

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MagicAlloy low-melting point alloy 58 °C for SMD component removal

MagicAlloy low-temperature SMD removal alloy 58°C

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In stock

30,80 € VAT ExcI.

Low-melting point alloy for SMD component removal. Melts at only 58 °C and allows for desoldering electronic components while reducing the risk of damage to PCBs and SMD parts. Supplied in 9 filaments of 15 cm, for a total of 1.35 m.

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SAC305 soldering and reballing spheres Ø 0.20mm 250,000pcs

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Available on backorder

126,95 € VAT ExcI.

Lead-free BGA soldering and reballing spheres in SAC305 Sn96.5/Ag3.0/Cu0.5 alloy, diameter 0.20 mm / 0.008", melting range 217–220 °C. Supplied in a jar of approximately 250,000 spheres, counted by weight. RoHS 3 and REACH compliant.

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SAC305 soldering and reballing spheres Ø 0.20mm 25,000pcs

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Available on backorder

29,99 € VAT ExcI.

Lead-free BGA soldering and reballing spheres in SAC305 Sn96.5/Ag3.0/Cu0.5 alloy, diameter 0.20 mm / 0.008", melting range 217–220 °C. Supplied in a jar of approximately 25,000 spheres, counted by weight. RoHS 3 and REACH compliant.

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SAC305 Solder and Reballing Spheres Ø 0.25mm 250,000pcs

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Available on backorder

125,95 € VAT ExcI.

Lead-free BGA solder and reballing spheres in SAC305 Sn96.5/Ag3.0/Cu0.5 alloy, diameter 0.25 mm / 0.010", melting range 217–220 °C. Supplied in a jar of approx. 250,000 spheres, measured by weight. RoHS 3 and REACH compliant.

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SAC305 soldering and reballing spheres Ø 0.25mm 25000pcs

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Available on backorder

28,99 € VAT ExcI.

Lead-free BGA soldering and reballing spheres in SAC305 Sn96.5/Ag3.0/Cu0.5 alloy, diameter 0.25 mm / 0.010", melting range 217–220 °C. Supplied in a jar of approx. 25,000 spheres, measured by weight. RoHS 3 and REACH compliant.

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SAC305 Solder and Reballing Spheres Ø 0.30 mm, 250,000 pcs

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Available on backorder

124,95 € VAT ExcI.

Lead-free BGA solder and reballing spheres in SAC305 Sn96.5/Ag3.0/Cu0.5 alloy, diameter 0.30 mm / 0.012", melting range 217–220 °C. Supplied in a jar of approximately 250,000 spheres, counted by weight. RoHS 3 and REACH compliant.

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SAC305 Solder and Reballing Spheres Ø 0.30mm 25000pcs

, ,

Available on backorder

27,99 € VAT ExcI.

Lead-free BGA solder and reballing spheres in SAC305 Sn96.5/Ag3.0/Cu0.5 alloy, diameter 0.30 mm / 0.012", melting range 217–220 °C. Supplied in a jar of approximately 25,000 spheres, measured by weight. RoHS 3 and REACH compliant.

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SAC305 soldering and reballing spheres Ø 0.35mm 250,000pcs

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Available on backorder

123,95 € VAT ExcI.

Lead-free BGA soldering and reballing spheres in SAC305 Sn96.5/Ag3.0/Cu0.5 alloy, diameter 0.35 mm / 0.014", melting range 217–220 °C. Supplied in a jar of approx. 250,000 spheres, measured by weight. RoHS 3 and REACH compliant.

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SAC305 soldering and reballing spheres Ø 0.35mm 25,000pcs

, ,

Available on backorder

26,99 € VAT ExcI.

Lead-free BGA soldering and reballing spheres in SAC305 Sn96.5/Ag3.0/Cu0.5 alloy, diameter 0.35 mm / 0.014", melting range 217–220 °C. Supplied in a jar of approximately 25,000 spheres, measured by weight. RoHS 3 and REACH compliant.

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SAC305 Solder and Reballing Spheres Ø 0.40mm, 250,000 pcs

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Available on backorder

122,95 € VAT ExcI.

Lead-free BGA solder and reballing spheres in SAC305 Sn96.5/Ag3.0/Cu0.5 alloy, diameter 0.40 mm / 0.016", melting range 217–220 °C. Supplied in a jar of approximately 250,000 spheres, counted by weight. RoHS 3 and REACH compliant.

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SAC305 Solder and Reballing Spheres Ø 0.40mm 25,000 pcs

, ,

Available on backorder

25,99 € VAT ExcI.

Lead-free BGA solder and reballing spheres in SAC305 Sn96.5/Ag3.0/Cu0.5 alloy, diameter 0.40 mm / 0.016", melting range 217–220 °C. Supplied in a jar of approximately 25,000 spheres, counted by weight. RoHS 3 and REACH compliant.

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SAC305 Solder and Reballing Spheres Ø 0.45mm, 250,000pcs

, ,

Available on backorder

125,54 € VAT ExcI.

Lead-free SAC305 Sn96.5/Ag3.0/Cu0.5 alloy solder and reballing spheres for BGA, diameter 0.45 mm / 0.018", melting range 217–220 °C. Supplied in a jar of approximately 250,000 spheres, counted by weight. RoHS 3 and REACH compliant.

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SAC305 Solder and Reballing Spheres Ø 0.45mm, 25,000 pcs

, ,

Available on backorder

24,99 € VAT ExcI.

Lead-free BGA solder and reballing spheres in SAC305 Sn96.5/Ag3.0/Cu0.5 alloy, diameter 0.45 mm / 0.018″, melting range 217–220 °C. Supplied in a jar of approximately 25,000 spheres, counted by weight. RoHS 3 and REACH compliant.

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SAC305 Ø 0.50mm Solder and Reballing Spheres, 250,000 pcs

, ,

Available on backorder

130,50 € VAT ExcI.

Lead-free BGA solder and reballing spheres in SAC305 Sn96.5/Ag3.0/Cu0.5 alloy, diameter 0.50 mm / 0.020", melting range 217–220 °C. Supplied in a jar of approximately 250,000 spheres, counted by weight. RoHS 3 and REACH compliant.

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SAC305 soldering and reballing spheres Ø 0.50mm 25,000pcs

, ,

Available on backorder

24,19 € VAT ExcI.

Lead-free BGA soldering and reballing spheres in SAC305 Sn96.5/Ag3.0/Cu0.5 alloy, 0.50 mm / 0.020" diameter, 217–220 °C melting range. Supplied in a jar of approx. 25,000 spheres, counted by weight. RoHS 3 and REACH compliant.

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SAC305 Solder and Reballing Spheres Ø 0.60 mm, 250,000 pcs

, ,

Available on backorder

135,12 € VAT ExcI.

Lead-free BGA solder and reballing spheres in SAC305 Sn96.5/Ag3.0/Cu0.5 alloy, 0.60 mm / 0.024" diameter, melting range 217–220 °C. Supplied in a jar of approximately 250,000 spheres, counted by weight. RoHS 3 and REACH compliant.

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