MagicAlloy Lead Free alloy for SMD removal 79–91°C

MagicAlloy Lead Free is a special lead-free alloy for low-temperature removal of SMD components, designed to facilitate desoldering and rework operations on printed circuit boards.

Thanks to a melting point between 79 °C and 91 °C, the alloy allows the solder to stay molten longer and enables removal of SMD components at much lower temperatures than traditional soldering. This significantly reduces the risk of damaging traces, pads, PCBs, and components during removal.

Being Lead Free, it can be used in processes where lead-containing alloys must be avoided. The product is particularly useful on delicate components, multipin packages, or boards where limiting thermal stress is important.

Ideal for:

• Removal of SMD components
• Low-temperature desoldering
• Rework on delicate PCBs
• Lead-free processes
• Reduced thermal stress during removal
• Multipin components
• Precision electronic repairs
• Electronics labs and technical service centers
• Use with low-temperature no-clean flux

Recommended method of use

Apply a small amount of no-clean flux to the terminals of the component to be removed. Add MagicAlloy Lead Free alloy to the existing solder and heat gently until melted.

The alloy lowers the overall soldering temperature and keeps the metal molten longer, facilitating component removal with less thermal stress on the board and components.

After removal, clean the work area and remove any residue with suitable products, such as isopropyl alcohol (IPA).

Important note

This Lead Free version has a melting point of 79–91 °C. It should not be confused with the lower melting point version of 58 °C, which belongs to the leaded variant.