Low melting point lead-free alloy for SMD component removal. Melts at 79–91 °C and enables desoldering of electronic components while reducing the risk of damage to PCBs and SMD parts. Supplied in 9 filaments of 15 cm, for a total of 1.35 m.
Low-melting point alloy for SMD component removal. Melts at only 58 °C and allows for desoldering electronic components while reducing the risk of damage to PCBs and SMD parts. Supplied in 9 filaments of 15 cm, for a total of 1.35 m.
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