MagicAlloy low-temperature SMD removal alloy 58°C

MagicAlloy is a special alloy for low-temperature SMD component removal, designed to facilitate desoldering and rework operations on printed circuit boards.

Thanks to the melting point of only 58 °C, the alloy allows the solder to remain molten longer and enables the removal of SMD components using much lower temperatures compared to traditional soldering. This significantly reduces the risk of damaging traces, pads, PCBs, and components during removal.

The product is particularly useful when working on delicate components, multi-pin packages, or boards where it is necessary to limit thermal stress.

For best results, use in combination with a no-clean tack flux, such as SMD291 flux or equivalent.

Ideal for:

• Removal of SMD components
• Low-temperature desoldering
• Rework on delicate PCBs
• Reduced thermal stress during removal
• Multipin components
• Precision electronic repairs
• Electronics labs and technical service centers
• Use in combination with no-clean tack flux

Handling note

Apply a small amount of no-clean flux to the terminals of the component to be removed. Add the MagicAlloy alloy to the existing solder and heat gently until molten. The alloy lowers the overall temperature of the solder, keeping it fluid longer and facilitating component removal.

After removal, clean the work area and remove any residue with suitable products, such as isopropyl alcohol (IPA).