SAC305 Solder and Reballing Spheres Ø 0.60 mm, 250,000 pcs
135,12 € VAT ExcI.
Lead-free BGA solder and reballing spheres in SAC305 Sn96.5/Ag3.0/Cu0.5 alloy, 0.60 mm / 0.024″ diameter, melting range 217–220 °C. Supplied in a jar of approximately 250,000 spheres, counted by weight. RoHS 3 and REACH compliant.
| Weight | 0,3 kg |
|---|---|
| Dimensions | 7 × 7 × 5 cm |
| FLT-Soldering-Product Typ | BGA Solder Spheres |
| FLT-Soldering-Alloy | Tin / Silver / Copper Sn96.5Ag3Cu0.5 (SAC305) |
| FLT-Lead Free | Yes |
| FLT-Soldering-Flux | Flux-free – solid core |
| FLT-Package | Jar |
| FLT-Size | Ø 0.60mm |
| FLT-Quantity | 250k |
Available on backorder
The SAC305 solder and reballing spheres are lead-free BGA spheres in Tin/Silver/Copper Sn96.5/Ag3.0/Cu0.5 alloy, designed for soldering, reballing, and repair operations on electronic components.
The sphere diameter is 0.60 mm / 0.024″, suitable for reballing operations on compatible BGA components. The SAC305 alloy has a melting range of 217–220 °C and is widely used in lead-free electronic applications thanks to its good wettability, reliability, and mechanical strength of the joint.
The product is lead-free, compliant with RoHS 3 and REACH directives, and is supplied in a jar of approximately 250,000 spheres, counted by weight.
Ideal for:
- BGA Reballing
- Soldering BGA components
- Precision electronic repairs
- Rework on electronic boards
- Electronics labs and technical service centers
- Lead-free applications
- Processing with SAC305 Sn96.5/Ag3.0/Cu0.5 alloy
| Feature | Description |
|---|---|
| Product code | SLD-SPH-SMD2050-250k |
| Product type | BGA solder and reballing spheres |
| Alloy | SAC305 Tin/Silver/Copper Sn96.5/Ag3.0/Cu0.5 |
| Composition | 96.5% Tin / 3.0% Silver / 0.5% Copper |
| Sphere diameter | 0.60 mm / 0.024″ |
| Quantity | Approximately 250,000 spheres |
| Counting method | Counted by weight |
| Melting range | 217–220 °C / 423–428 °F |
| Lead-free | Yes |
| Compliance | RoHS 3 and REACH |
| Packaging | Jar |
| Shelf life | >24 months |
| Transport | No specific restrictions |
| Recommended applications | BGA reballing, BGA soldering, rework, and precision electronic repairs |
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