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Kit of 3 stainless steel BeM FIX stencils for positioning Blue&Me ARM STA2062A and Xilinx XC3S400 NAND memories.
Kit of 3 NAND positioning templates for Blue&Me ARM STA2062A and Xilinx XC3S400 Original price was: 117,00 €.Current price is: 99,45 €. VAT ExcI.

Samsung K9F5608U0D NAND Positioning Template, 9 × 11 mm

39,00 € VAT ExcI.

BeM FIX stainless steel template for correct positioning of the Samsung K9F5608U0D NAND memory in 9 × 11 mm package.

Non-magnetic and acid-resistant, it is designed for rework operations on Blue&Me units based on Xilinx XC3S400 FPGA.

Weight0,05 kg
Dimensions9 × 6 × 2 cm

In stock (can be backordered)

Description

Samsung K9F5608U0D NAND Positioning Template

The BeM FIX BEMFIX-DIM-003 template enables correct positioning of the Samsung K9F5608U0D NAND memory during repair and rework operations on Blue&Me units based on Xilinx XC3S400.

The template is designed for components with dimensions of 9 × 11 mm and facilitates correct alignment of the memory on the PCB before soldering.

Compatibility

The template is designed for:

  • Samsung K9F5608U0D NAND memory;
  • 9 × 11 mm package;
  • Blue&Me units;
  • systems based on Xilinx XC3S400.

Before use, always verify the complete memory code and the actual package dimensions installed on the board.

Stainless Steel Construction

The template is made of stainless steel, a material suitable for professional microsoldering and rework operations.

Key features include:

  • non-magnetic properties;
  • acid resistance;
  • resistance to products used during rework;
  • good dimensional stability;
  • reusability.

Applications

The template can be used during:

  • NAND memory replacement;
  • Blue&Me unit repair;
  • component positioning before soldering;
  • BGA rework;
  • memory alignment on the PCB.

Usage Instructions

Position the template on the PCB, aligning the opening with the NAND memory footprint.

Insert the component into the template, verify correct pin 1 orientation, and proceed with soldering using the appropriate rework technique.

The template only facilitates component positioning and does not replace cleaning, preparation, reballing, or soldering operations.

Watch the tutorial on YouTube

Technical Specifications

Feature Value
Product code BEMFIX-DIM-003
Application Blue&Me units
Associated platform Xilinx XC3S400
Compatible memory Samsung K9F5608U0D
Package size 9 × 11 mm
Material Stainless steel
Properties Non-magnetic, acid-resistant
Use NAND positioning during rework

Package Contents

Component Quantity
Samsung K9F5608U0D NAND positioning template 1

Important Information

The product includes only the positioning template.

The NAND memory, Blue&Me board, and any tools shown in the images are not included.

Before soldering, always verify correct component orientation.

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