Kapton polyamide tape, heat-resistant, with silicone adhesive, 33 m

Kapton polyamide tape with silicone adhesive is designed to protect components, connectors, traces, and surfaces during processes involving high temperatures.

The thin, durable film allows for precise masking even near small electronic components.

Silicone adhesive

The silicone adhesive ensures good hold during heating and allows for clean removal after processing, reducing the risk of residue on the surface.

It is particularly suited for electronic applications where it is necessary to temporarily protect areas of the board during soldering, rework, or heat treatment.

Applications

The tape can be used for:

• masking electronic boards;
• protecting components during soldering and desoldering;
• BGA rework and microsoldering;
• protecting gold-plated contacts on printed circuit boards;
• electrical insulation;
• temporary fastening of components;
• sublimation processes;
• protecting surfaces during heat treatments;
• use on compatible 3D printing beds.

Available widths

The 5 mm variant is suited for localized masking and small areas.

The 10 mm variant offers a good compromise for common electronic processes.

The 25 mm variant is suited for protecting larger surfaces.

Thermal resistance

The tape is suited for high-temperature processes typical of soldering and electronic rework.

For polyamide tapes with silicone adhesive of this type, the commonly stated thermal range reaches up to approximately 260 °C for limited exposures.

The actual sustainable temperature depends on exposure duration, application surface, and operating conditions.

Main features

• polyamide film backing;
• silicone adhesive;
• good high-temperature stability;
• electrical insulation properties;
• good chemical resistance;
• precise application;
• easy removal;
• suited for electronic and industrial processes.

Technical specifications

Resistance to high temperatures

The polyamide tape with silicone adhesive is designed to work within a temperature range of −73 °C to +260 °C.

It is suited for protecting and masking components during soldering, desoldering, electronic rework, and other processes involving exposure to high temperatures.

Actual performance may vary depending on exposure duration, application surface, and operating conditions.

Important Information

The maximum temperature depends on exposure time and usage conditions.

Before use on delicate, painted, or adhesive-sensitive surfaces, test on a non-visible area.

The product is not intended to provide permanent thermal insulation from continuous heat sources.