Sn63Pb37 soldering and reballing spheres Ø 0.65mm 25,000pcs

23,75 € VAT ExcI.

BGA soldering and reballing spheres in Tin/Lead alloy Sn63Pb37, diameter 0.65 mm / 0.026″, melting point 183 °C. Supplied in a jar of approximately 25,000 spheres, counted by weight.

Weight	0,05 kg
Dimensions	5 × 5 × 4 cm
FLT-Soldering-Product Typ	BGA Solder Spheres
FLT-Soldering-Alloy	Tin / Lead Sn63Pb37
FLT-Lead Free	No
FLT-Soldering-Flux	Flux-free – solid core
FLT-Package	Jar
FLT-Size	Ø 0.65mm
FLT-Quantity	25k

Available on backorder

SKU: SLD-SPH-SMD2210 Categories: Soldering and Rework, Welding consumables, BGA Reballing Tags: BGA balls, BGA reballing spheres, electronic soldering, rework PCB, Sn63Pb37, solder spheres, soldering consumables, tin lead

Description

Sn63Pb37 solder and reballing spheres are BGA spheres in Tin/Lead 63/37 alloy, designed for soldering, reballing, and repair operations on electronic components.

The sphere diameter is 0,65 mm / 0,026″, suitable for reballing operations on compatible BGA components. The Sn63/Pb37 alloy has a melting point of 183 °C, a feature that promotes good flow during soldering and regular joint formation.

The product is supplied in a jar of approximately 25,000 spheres, counted by weight.

Ideal for:

BGA Reballing
Soldering BGA components
Precision electronic repairs
Rework on electronic boards
Electronics labs and technical service centers
Applications with Tin/Lead Sn63Pb37 alloy

Lead content warning

This product contains lead. Use with proper safety precautions, avoiding direct inhalation of solder fumes and unnecessary contact with the material.

Use in adequately ventilated environments with fume extraction systems and suitable protective equipment is recommended. Wash hands thoroughly after use and do not eat, drink, or smoke while handling the product.

Feature	Description
Product code	SLD-SPH-SMD2210
Product type	BGA solder and reballing spheres
Alloy	Tin/Lead Sn63/Pb37
Composition	63% Tin / 37% Lead
Sphere diameter	0.65 mm / 0.026″
Quantity	Approximately 25,000 spheres
Counting method	Counted by weight
Melting point	183 °C / 361 °F
Packaging	Jar
Shelf life	> months
Transport	No specific restrictions
Recommended applications	BGA reballing, BGA soldering, rework, and precision electronic repairs

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