Sn42Bi57.6Ag0.4 BGA soldering and reballing spheres Ø 0.40mm 25,000pcs
59,95 € VAT ExcI.
Lead-free BGA soldering and reballing spheres in Tin/Bismuth/Silver Sn42/Bi57.6/Ag0.4 alloy, diameter 0.40 mm / 0.016″, melting point 138 °C. Supplied in a jar of approx. 25,000 spheres, counted by weight. RoHS 3 and REACH compliant.
| Weight | 0,05 kg |
|---|---|
| Dimensions | 5 × 5 × 4 cm |
| FLT-Soldering-Product Typ | BGA Solder Spheres |
| FLT-Soldering-Alloy | Tin / Bismuth / Silver Sn42Bi57.6Ag0.4 (LowTemp) |
| FLT-Lead Free | Yes |
| FLT-Soldering-Flux | Flux-free – solid core |
| FLT-Package | Jar |
| FLT-Size | Ø 0.40mm |
| FLT-Quantity | 25k |
Available on backorder
Sn42/Bi57.6/Ag0.4 solder and reballing spheres are lead-free BGA spheres in Tin/Bismuth/Silver alloy, designed for soldering, reballing, and repair operations on electronic components requiring a reduced process temperature.
The sphere diameter is 0.40 mm / 0.016″, suitable for reballing operations on compatible BGA components. The Sn42/Bi57.6/Ag0.4 alloy has a melting point of 138 °C, significantly lower than common traditional alloys, and allows for limiting thermal stress on particularly delicate components and printed circuit boards.
The product is lead-free, compliant with RoHS 3 and REACH directives, and is supplied in a jar of approximately 25,000 spheres, counted by weight.
Ideal for:
- Low temperature BGA reballing
- Soldering of heat-sensitive BGA components
- Precision electronic repairs
- Rework on electronic boards
- Reduction of thermal stress on PCB and components
- Electronics labs and technical service centers
- Lead-free applications with Sn42/Bi57.6/Ag0.4 alloy
| Feature | Description |
|---|---|
| Product code | SLD-SPH-SNBIAG-040 |
| Product type | Low temperature BGA solder and reballing spheres |
| Alloy | Tin/Bismuth/Silver Sn42/Bi57.6/Ag0.4 |
| Composition | 42% Tin / 57.6% Bismuth / 0.4% Silver |
| Sphere diameter | 0.40 mm / 0.016″ |
| Quantity | Approximately 25,000 spheres |
| Counting method | Counted by weight |
| Melting point | 138 °C / 281 °F |
| Lead-free | Yes |
| Compliance | RoHS 3 and REACH |
| Packaging | Jar |
| Shelf life | > months |
| Transport | No specific restrictions |
| Recommended applications | Low temperature BGA reballing, BGA soldering, rework and precision electronic repairs |
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