No-Clean Soldering Flux – 75 g Jar – Leaded & Lead-Free

The 75 g flux jar contains a low-viscosity synthetic flux paste, supplied in a convenient container for bench use.

NO-CLEAN technology allows the flux to be used in electronics soldering applications where residue removal after processing is not always required. The product is suitable for soft soldering with tin/lead and tin/silver/copper alloys, making it suitable for both traditional leaded and lead-free applications.

The formulation is non-corrosive and non-conductive. Residues can be easily removed with isopropyl alcohol (IPA).

It is particularly suitable for precision soldering, touch-ups, PCB rework, soldering and desoldering of electronic components, and refreshing existing solder on PCBs. The 75 g jar is ideal for electronics workshops, technical repair services and workstations where flux is used frequently.

Ideal for:

• Electronics soldering
• Desoldering and rework
• PCB touch-ups
• Refreshing existing solder
• Precision electronic repairs
• Frequent soldering work at the bench
• Electronics workshops, technical repair services and electronics manufacturing
• Applications where a larger container is preferred over syringes and tubes

Warning about counterfeit products

Beware of counterfeit products or products from unverified sources. Flux is a chemical product and must be used with appropriate safety precautions in adequately ventilated areas, preferably with fume extraction systems.

Low-quality products may generate uncontrolled fumes, residues or contaminants, increasing risks to the operator and compromising the reliability of electronics assembly and repair work.