NO CLEAN SD Desoldering Braid 1.8 mm 3 m

The 1.8 mm NO CLEAN SD desoldering braid is designed for the fast and effective removal of excess solder from printed circuit boards and electronic components.

The 1.8 mm / 0.070″ size, corresponding to Size #3, is particularly suited for work on large SMD pads and PTH through-hole components, where greater solder absorption capacity is required compared to thinner braids.

The braid is made of pure oxygen-free copper and uses a non-corrosive, halide-free, organic-based NO CLEAN SD flux technology. This formulation enables effective desoldering, reducing harmful residues and leaving the PCB clean and ready for component repositioning or new soldering.

The braid’s low-mass construction and high thermal conductivity provide a fast response even at lower temperatures, limiting the risk of overheating and damage to the printed circuit board.

Perfect for:

• Removing excess solder from PCBs
• Cleaning large SMD pads
• PTH through-hole components
• Rework and electronic repairs
• Preparing the PCB before component repositioning
• Fast desoldering with reduced risk of overheating
• Electronics labs and technical service centers
• Use where greater absorption capacity is needed compared to finer sizes
  

  Feature	Description
  Product code	SLD-SLW-003
  Product type	Desoldering braid
  Technology	NO CLEAN SD
  Size	Size #3
  Braid width	1.8 mm / 0.070″
  Length	3.048 m / 10 ft
  Material	Pure oxygen-free copper
  Flux type	Organic no-clean, non-corrosive, and halide-free
  ANSI/IPC J-STD-004 classification	ROL0
  Residues	Reduced, suitable for no-clean processes
  Recommended applications	Solder removal from PCBs, large SMD pads, and PTH components
  Main advantage	High solder absorption capacity for work on larger pads and components