Solder Wire
SAC305 Lead-Free Solder Wire Spool – RA 2.2% – Ø 0.5 mm – 113.5 g
In stock
32,70 € VAT ExcI.Lead-free solder wire made from SAC305 tin/silver/copper alloy (Sn96.5/Ag3.0/Cu0.5), with a diameter of 0.5 mm and a 2.2% rosin-activated (RA) flux core. Melting range: 217–220 °C. Supplied on a 113,5 g spool.
SAC305 Lead-Free Solder Wire – 2.2% RA Flux – Ø 0.5 mm – 227 g
Available on backorder
60,00 € VAT ExcI.Lead-free solder wire made from SAC305 tin/silver/copper alloy (Sn96.5/Ag3.0/Cu0.5), with a diameter of 0.5 mm and a 2.2% rosin-activated (RA) flux core. Melting range: 217–220 °C. Supplied on a 227 g spool.
SAC305 Lead-Free Solder Wire – 2.2% RA Flux – Ø 0.5 mm – 454 g
Available on backorder
114,80 € VAT ExcI.Bobina di filo per saldatura Lead Free in lega Stagno/Argento/Rame SAC305 Sn96.5Ag3Cu0.5, diametro 0,5 mm, con flussante interno RA Rosin Activated al 2,2%. Punto di fusione 217–220 °C, peso 454 g.
LowTemp Sn42/Bi57/Ag1 Lead-Free Solder Wire – 2.2% RA Flux – Ø 1.0 mm – 200 g
Available on backorder
180,10 € VAT ExcI.LowTemp lead-free solder wire made from Sn42/Bi57/Ag1 alloy, with a diameter of 1.0 mm and a 2.2% no-clean rosin-activated (RA) flux core. Melting point: 138 °C. Supplied on a 200 g spool. Ideal for rework and low-temperature soldering.
LowTemp Sn42/Bi57/Ag1 Lead-Free Solder Wire – 2.5% WW Flux – Ø 1.0 mm – 200 g
Available on backorder
184,60 € VAT ExcI.LowTemp lead-free solder wire made from Sn42/Bi57/Ag1 alloy, with a diameter of 1.0 mm and a 2.5% No-Clean Water-Washable flux core. Melting point: 138 °C. Supplied on a 200 g spool. Ideal for rework and low-temperature soldering.
Sn63Pb37 Tin/Lead Solder Wire Spool – RA 2.2% – Ø 0.5 mm – 113.5 g
In stock
12,10 € VAT ExcI.Tin/lead Sn63Pb37 solder wire spool, Ø 0.5 mm, with 2.2% rosin-activated (RA) flux core. Eutectic alloy with a melting point of 183 °C. Spool weight: 113.5 g. Ideal for professional electronics soldering and PCB rework.
Sn63Pb37 Tin/Lead Solder Wire Spool – RA 2.2% – Ø 0.5 mm – 227 g
Available on backorder
25,70 € VAT ExcI.Tin/lead Sn63Pb37 solder wire spool, Ø 0.5 mm, with 2.2% rosin-activated (RA) flux core. Eutectic alloy with a melting point of 183 °C. Spool weight: 227 g / 1/2 lb. Ideal for professional electronics soldering and PCB rework.
Sn63Pb37 Tin/Lead Solder Wire Spool – RA 2.2% – Ø 0.5 mm – 454 g
Available on backorder
35,00 € VAT ExcI.Tin/lead Sn63Pb37 solder wire spool, Ø 0.5 mm, with 2.2% rosin-activated (RA) flux core. Eutectic alloy with a melting point of 183 °C. Spool weight: 454 g / 1 lb. Ideal for professional electronics soldering and PCB rework.