SAC305 Lead-Free Solder Wire Spool – RA 2.2% – Ø 0.5 mm – 113.5 g

32,70 € VAT ExcI.

Lead-free solder wire made from SAC305 tin/silver/copper alloy (Sn96.5/Ag3.0/Cu0.5), with a diameter of 0.5 mm and a 2.2% rosin-activated (RA) flux core. Melting range: 217–220 °C. Supplied on a 113,5 g spool.

Weight0,150 kg
Dimensions6 × 6 × 3 cm
FLT-Soldering-Product Typ
FLT-Soldering-Alloy
FLT-Lead FreeYes
FLT-Soldering-FluxRosin Activated (RA)
FLT-PackageCoil
FLT-SizeØ 0.50mm
FLT-Quantity113.5g (4oz)

Only 1 left in stock (can be backordered)

Description

SAC305 is a high-quality, lead-free tin/silver/copper solder wire for electronics, supplied on a 227 g spool with a wire diameter of 0.5 mm.

The Sn96.5/Ag3.0/Cu0.5 alloy, also known as SAC305, is a lead-free alloy composed of tin, silver and copper. It has a melting range of 217–220 °C and is suitable for electronics assembly and repair requiring lead-free solder.

The wire features a 2.2% rosin-activated (RA) flux core, which provides greater activity than standard rosin fluxes and is also suitable for surfaces that are more difficult to solder.

The flux is classified as ROM1 according to IPC J-STD-004.

The product complies with RoHS 3 and REACH. Its lead-free composition makes it suitable for soldering Lead-free components and PCBs.

Ideal for:

  • Lead-free soldering for electronics
  • Rework and repairs on lead-free PCBs
  • Precision soldering
  • Through-hole components and wiring
  • Hard-to-solder surfaces
  • Electronics workshops and repair centres
  • RoHS and REACH compliant applications
  • Applications requiring SAC305 alloy with activated rosin flux
Feature Description
Product code SLD-SNW-001-LF
Product type Lead-free solder wire spool
Alloy Tin/Silver/Copper SAC305
Composition Sn96.5 / Ag3.0 / Cu0.5
Compatibility Lead Free
Wire diameter 0,5 mm
Wire diameter (inches) Approx. 0.020″
Spool weight 113.5 g / 4 oz
Melting range 217–220 °C
Flux core Rosin-activated (RA)
Flux content 2,2%
IPC J-STD-004 classification ROM1
Compliance RoHS 3, REACH
Shelf life >60 months
Recommended applications Lead-free soldering for electronics, rework, PCB repair, through-hole components and wiring
Hard-to-solder surfaces Suitable thanks to the higher activity of the RA flux

 

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