SAC305 Lead-Free Solder Wire – 2.2% RA Flux – Ø 0.5 mm – 454 g
114,80 € VAT ExcI.
Bobina di filo per saldatura Lead Free in lega Stagno/Argento/Rame SAC305 Sn96.5Ag3Cu0.5, diametro 0,5 mm, con flussante interno RA Rosin Activated al 2,2%. Punto di fusione 217–220 °C, peso 454 g.
| Weight | 0,5 kg |
|---|---|
| Dimensions | 6 × 6 × 12 cm |
| FLT-Soldering-Product Typ | Solder Wire |
| FLT-Soldering-Alloy | Tin / Silver / Copper Sn96.5Ag3Cu0.5 (SAC305) |
| FLT-Lead Free | Yes |
| FLT-Soldering-Flux | Rosin Activated (RA) |
| FLT-Package | Coil |
| FLT-Size | Ø 0.50mm |
| FLT-Quantity | 454g (1lb) |
Available on backorder
SAC305 is a high-quality, lead-free tin/silver/copper solder wire for electronics, supplied on a 454 g spool with a wire diameter of 0.5 mm.
The Sn96.5/Ag3.0/Cu0.5 alloy, also known as SAC305, is a lead-free alloy composed of tin, silver and copper. It has a melting range of 217–220 °C and is suitable for electronics assembly and repair requiring lead-free solder.
The wire features a 2.2% rosin-activated (RA) flux core, which provides greater activity than standard rosin fluxes and is also suitable for surfaces that are more difficult to solder.
The flux is classified as ROM1 according to IPC J-STD-004.
The product is RoHS 3 and REACH compliant. Its lead-free composition makes it suitable for soldering lead-free components and PCBs.
The 454 g / 1 lb spool is ideal for electronics workshops, repair centres, electronics manufacturing and soldering workstations where solder wire is used frequently.
Ideal for:
- Lead-free soldering for electronics
- Rework and repairs on lead-free PCBs
- Precision soldering
- Through-hole components and wiring
- Hard-to-solder surfaces
- Electronics workshops and repair centres
- Electronics manufacturing
- Intensive use at soldering workstations
- RoHS and REACH compliant applications
- Applications requiring SAC305 alloy with activated rosin flux
| Feature | Description |
|---|---|
| Product code | SLD-SNW-003-LF |
| Product type | Lead-free solder wire spool |
| Alloy | Tin/Silver/Copper SAC305 |
| Composition | Sn96.5 / Ag3.0 / Cu0.5 |
| Compatibility | Lead Free |
| Wire diameter | 0,5 mm |
| Wire diameter (inches) | Approx. 0.020″ |
| Spool weight | 454 g / 1 lb |
| Melting range | 217–220 °C |
| Flux core | |
| Flux content | 2,2% |
| ClasIPC J-STD-004 classification sificazione IPC J-STD-004 |
ROM1 |
| Compliance | RoHS 3, REACH |
| Shelf life | >60 months |
| Recommended applications | Lead-free soldering for electronics, rework, PCB repair, through-hole components, wiring and electronics manufacturing |
| Hard-to-solder surfaces | Suitable thanks to the higher activity of the RA flux |
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