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454 g spool of SAC305 lead-free solder wire, 0.5 mm diameter

SAC305 Lead-Free Solder Wire – 2.2% RA Flux – Ø 0.5 mm – 454 g

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Available on backorder

114,80 € VAT ExcI.

Bobina di filo per saldatura Lead Free in lega Stagno/Argento/Rame SAC305 Sn96.5Ag3Cu0.5, diametro 0,5 mm, con flussante interno RA Rosin Activated al 2,2%. Punto di fusione 217–220 °C, peso 454 g.

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Sn63Pb37 tin/lead solder wire spool Ø 0.5 mm, RA 2.2% flux, 454 g

Sn63Pb37 Tin/Lead Solder Wire Spool – RA 2.2% – Ø 0.5 mm – 454 g

,

Available on backorder

35,00 € VAT ExcI.

Tin/lead Sn63Pb37 solder wire spool, Ø 0.5 mm, with 2.2% rosin-activated (RA) flux core. Eutectic alloy with a melting point of 183 °C. Spool weight: 454 g / 1 lb. Ideal for professional electronics soldering and PCB rework.

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