LowTemp Sn42/Bi57/Ag1 Lead-Free Solder Wire – 2.2% RA Flux – Ø 1.0 mm – 200 g

LowTemp Sn42/Bi57/Ag1 is a low-melting-point, lead-free solder wire for electronics, supplied on a 200 g spool with a wire diameter of 1.0 mm.

The Sn42/Bi57/Ag1 alloy combines tin, bismuth and silver for applications requiring lower soldering temperatures. Its low melting point of 138 °C makes it particularly suitable for delicate soldering work, rework and repairs involving heat-sensitive components or PCBs.

The wire features a 2.2% no-clean rosin-activated (RA) flux core, which promotes solder flow during heating and helps produce smooth, uniform solder joints. The addition of 1% silver helps improve solder joint ductility and strength compared with conventional tin/bismuth alloys.

The flux is classified as ROM0 according to IPC J-STD-004.

The product complies with RoHS 3 and REACH. Its lead-free composition makes it suitable for soldering Lead-free components and PCBs.

Ideal for:

• Low-temperature, lead-free soldering for electronics
• Rework on heat-sensitive PCBs
• Precision electronic repairs
• Delicate or heat-sensitive components
• Applications requiring reduced thermal stress
• Electronics workshops and repair centres
• RoHS and REACH compliant applications
• Applications requiring a low-temperature solder alloy with no-clean RA flux

Handling note

The Sn42/Bi57/Ag1 alloy produces strong solder joints with improved ductility thanks to its 1% silver content. However, the wire itself may be more brittle than other solder wires.

Handle the wire carefully when unwinding it from the spool. Small breaks in the coiled wire are normal for this type of alloy.