Sn42Bi57.6Ag0.4 solder and reballing spheres Ø 0.50mm 25,000pcs
62,95 € VAT ExcI.
Lead-free BGA solder and reballing spheres in Tin/Bismuth/Silver Sn42/Bi57.6/Ag0.4 alloy, diameter 0.50 mm / 0.020″, melting point 138 °C. Supplied in a jar of approx. 25,000 spheres, counted by weight. RoHS 3 and REACH compliant.
| Weight | 0,05 kg |
|---|---|
| Dimensions | 5 × 5 × 4 cm |
| FLT-Soldering-Product Typ | BGA Solder Spheres |
| FLT-Soldering-Alloy | Tin / Bismuth / Silver Sn42Bi57.6Ag0.4 (LowTemp) |
| FLT-Lead Free | Yes |
| FLT-Soldering-Flux | Flux-free – solid core |
| FLT-Package | Jar |
| FLT-Size | Ø 0.50mm |
| FLT-Quantity | 25k |
Available on backorder
Sn42/Bi57.6/Ag0.4 solder and reballing spheres are lead-free BGA spheres in Tin/Bismuth/Silver alloy, designed for soldering, reballing, and repair operations on electronic components requiring a reduced process temperature.
The sphere diameter is 0.50 mm / 0.020″, suitable for reballing operations on compatible BGA components. The Sn42/Bi57.6/Ag0.4 alloy has a melting point of 138 °C, significantly lower than common traditional alloys, and helps limit thermal stress on particularly delicate components and printed circuit boards.
The product is lead-free, compliant with RoHS 3 and REACH directives, and is supplied in a jar of approximately 25,000 spheres, counted by weight.
Ideal for:
- Low temperature BGA reballing
- Soldering of heat-sensitive BGA components
- Precision electronic repairs
- Rework on electronic boards
- Reduction of thermal stress on PCB and components
- Electronics labs and technical service centers
- Lead-free applications with Sn42/Bi57.6/Ag0.4 alloy
| Feature | Description |
|---|---|
| Product code | SLD-SPH-SNBIAG-050 |
| Product type | Low temperature BGA solder and reballing spheres |
| Alloy | Tin/Bismuth/Silver Sn42/Bi57.6/Ag0.4 |
| Composition | 42% Tin / 57.6% Bismuth / 0.4% Silver |
| Sphere diameter | 0.50 mm / 0.020″ |
| Quantity | Approximately 25,000 spheres |
| Counting method | Counted by weight |
| Melting point | 138 °C / 281 °F |
| Lead-free | Yes |
| Compliance | RoHS 3 and REACH |
| Packaging | Jar |
| Shelf life | > months |
| Transport | No specific restrictions |
| Recommended applications | Low temperature BGA reballing, BGA soldering, rework and precision electronic repairs |
Only logged in customers who have purchased this product may leave a review.
SHIPPING in 24/48 HOURS
for items in stock
Additional time may be required for special products or dedicated configurations.
Worldwide shipping
Deliveries in Italy and abroad
Protective packaging
Professional preparation of materials
Email tracking
Receive your tracking code immediately
Cost at checkout
Displayed before payment
Related products
SAC305 Solder and Reballing Spheres Ø 0.30 mm, 250,000 pcs
Available on backorder
SAC305 Solder and Reballing Spheres Ø 0.40mm 25,000 pcs
Available on backorder
SAC305 Solder and Reballing Spheres Ø 0.45mm, 250,000pcs
Available on backorder
SAC305 soldering and reballing spheres Ø 0.50mm 25,000pcs
Available on backorder
SAC305 Solder and Reballing Spheres Ø0.63mm 25,000pcs
Available on backorder
Sn42Bi57.6Ag0.4 Solder and Reballing Balls Ø 0.35mm, 25,000 pcs
Available on backorder
Sn42Bi57.6Ag0.4 soldering and reballing spheres Ø 0.60mm 25000pcs
Available on backorder
Reviews
There are no reviews yet.