Sn63Pb37 tin/lead alloy solder and reballing spheres for BGA, diameter 0.35 mm / 0.014", melting point 183 °C. Supplied in a jar of approximately 25,000 spheres, counted by weight.
We use technical cookies necessary for the operation of the site and, with your consent, statistical cookies to analyze traffic.
You can accept all cookies, reject them, or manage your preferences.
Functional
Always active
Technical storage or access is strictly necessary for the legitimate purpose of enabling the use of a specific service explicitly requested by the subscriber or user, or for the sole purpose of carrying out the transmission of a communication over an electronic communications network.
Preferences
Technical storage or access is necessary for the legitimate purpose of storing preferences that are not requested by the subscriber or user.
Statistics
Technical storage or access that is used exclusively for statistical purposes.Technical storage or access that is used exclusively for anonymous statistical purposes. Without a subpoena, voluntary compliance by your Internet Service Provider, or additional records from a third party, information stored or retrieved for this purpose alone cannot usually be used for identification.
Marketing
Technical storage or access is required to create user profiles to send advertising, or to track the user on a website or across several websites for similar marketing purposes.
