{"id":39103,"date":"2026-07-13T12:14:32","date_gmt":"2026-07-13T10:14:32","guid":{"rendered":"https:\/\/tsecengineering.shop\/shop\/lead-free-solder-wire-sn42bi57ag1-ra-200g\/"},"modified":"2026-10-21T13:00:10","modified_gmt":"2026-10-21T11:00:10","slug":"lead-free-solder-wire-sn42bi57ag1-ra-200g","status":"publish","type":"product","link":"https:\/\/tsecengineering.shop\/en\/shop\/lead-free-solder-wire-sn42bi57ag1-ra-200g\/","title":{"rendered":"LowTemp Sn42\/Bi57\/Ag1 Lead-Free Solder Wire &#8211; 2.2% RA Flux &#8211; \u00d8 1.0 mm &#8211; 200 g"},"content":{"rendered":"<p class=\"isSelectedEnd\"><strong>LowTemp Sn42\/Bi57\/Ag1<\/strong> is a low-melting-point, <strong>lead-free<\/strong> solder wire for electronics, supplied on a <strong>200 g<\/strong> spool with a wire diameter of <strong>1.0 mm<\/strong>.<\/p>\n<p class=\"isSelectedEnd\">The <strong>Sn42\/Bi57\/Ag1<\/strong> alloy combines tin, bismuth and silver for applications requiring lower soldering temperatures. Its low melting point of <strong>138 \u00b0C<\/strong> makes it particularly suitable for delicate soldering work, rework and repairs involving heat-sensitive components or PCBs. <\/p>\n<p class=\"isSelectedEnd\">The wire features a <strong>2.2% no-clean rosin-activated (RA)<\/strong> flux core, which promotes solder flow during heating and helps produce smooth, uniform solder joints. The addition of 1% silver helps improve solder joint ductility and strength compared with conventional tin\/bismuth alloys. <\/p>\n<p class=\"isSelectedEnd\">The flux is classified as <strong>ROM0<\/strong> according to IPC J-STD-004.<\/p>\n<p>The product complies with <strong>RoHS 3<\/strong> and <strong>REACH<\/strong>. Its lead-free composition makes it suitable for soldering <strong>Lead-free<\/strong> components and PCBs.<\/p>\n<h4 class=\"isSelectedEnd\">Ideal for:<\/h4>\n<ul data-spread=\"false\">\n<li>Low-temperature, lead-free soldering for electronics<\/li>\n<li>Rework on heat-sensitive PCBs<\/li>\n<li>Precision electronic repairs<\/li>\n<li>Delicate or heat-sensitive components<\/li>\n<li>Applications requiring reduced thermal stress<\/li>\n<li>Electronics workshops and repair centres<\/li>\n<li>RoHS and REACH compliant applications<\/li>\n<li>Applications requiring a low-temperature solder alloy with no-clean RA flux<\/li>\n<\/ul>\n<p><strong>Handling note<\/strong><\/p>\n<p class=\"isSelectedEnd\">The <strong>Sn42\/Bi57\/Ag1<\/strong> alloy produces strong solder joints with improved ductility thanks to its 1% silver content. However, the wire itself may be more brittle than other solder wires. <\/p>\n<p>Handle the wire carefully when unwinding it from the spool. Small breaks in the coiled wire are normal for this type of alloy. <\/p>\n<table>\n<tbody>\n<tr>\n<th>Feature<\/th>\n<th>Description<\/th>\n<\/tr>\n<tr>\n<td>Product code<\/td>\n<td>SLD-SNW-004-LF<\/td>\n<\/tr>\n<tr>\n<td>Product type<\/td>\n<td>LowTemp Lead-Free solder wire spool<\/td>\n<\/tr>\n<tr>\n<td>Alloy<\/td>\n<td>Tin\/Bismuth\/Silver Sn42\/Bi57\/Ag1<\/td>\n<\/tr>\n<tr>\n<td>Composition<\/td>\n<td>Sn42 \/ Bi57 \/ Ag1<\/td>\n<\/tr>\n<tr>\n<td>Compatibility<\/td>\n<td>Lead Free<\/td>\n<\/tr>\n<tr>\n<td>Wire diameter<\/td>\n<td>1.0 mm<\/td>\n<\/tr>\n<tr>\n<td>Equivalent diameter<\/td>\n<td>.040&#8243;<\/td>\n<\/tr>\n<tr>\n<td>Spool weight<\/td>\n<td>200 g<\/td>\n<\/tr>\n<tr>\n<td>Melting point<\/td>\n<td>138 \u00b0C<\/td>\n<\/tr>\n<tr>\n<td>Flux core<\/td>\n<td>No-clean rosin-activated (RA)<\/td>\n<\/tr>\n<tr>\n<td>Flux content<\/td>\n<td>2,2%<\/td>\n<\/tr>\n<tr>\n<td>Halogen content<\/td>\n<td>None<\/td>\n<\/tr>\n<tr>\n<td>IPC J-STD-004 classification<\/td>\n<td>ROM0<\/td>\n<\/tr>\n<tr>\n<td>Compliance<\/td>\n<td>RoHS 3, REACH<\/td>\n<\/tr>\n<tr>\n<td>Shelf life<\/td>\n<td>&gt;60 months<\/td>\n<\/tr>\n<tr>\n<td>Recommended applications<\/td>\n<td>Lead-free soldering for electronics, rework, PCB repair and low-temperature soldering of heat-sensitive components<\/td>\n<\/tr>\n<tr>\n<td>Usage note<\/td>\n<td>The wire may be brittle; handle with care when unwinding it from the spool.<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p>LowTemp lead-free solder wire made from Sn42\/Bi57\/Ag1 alloy, with a diameter of 1.0 mm and a 2.2% no-clean rosin-activated (RA) flux core. Melting point: 138 \u00b0C. Supplied on a 200 g spool. Ideal for rework and low-temperature soldering.  <\/p>\n","protected":false},"featured_media":35294,"comment_status":"open","ping_status":"closed","template":"","meta":[],"product_brand":[],"product_cat":[1869,1867],"product_tag":[2437,2333,2436,2434,2438,2441,2433,2332,2432,2442,2435,2334,2343],"class_list":["post-39103","product","type-product","status-publish","has-post-thumbnail","product_cat-welding-consumables","product_cat-soldering-rework","product_tag-1mm-tin","product_tag-electronic-soldering","product_tag-lead-free-solder-wire","product_tag-low-temp-solder-wire","product_tag-no-clean","product_tag-ra-flux","product_tag-reach","product_tag-rework-pcb","product_tag-rohs","product_tag-rom0","product_tag-sn42bi57ag1","product_tag-soldering-consumables","product_tag-tin-silver-copper-2","pa_flt-soldering-alloy-sn42-bi57ag1-low-temp","pa_flt-soldering-product-typ-solder-wire","first","onbackorder","taxable","shipping-taxable","purchasable","product-type-simple"],"_links":{"self":[{"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product\/39103","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/comments?post=39103"}],"version-history":[{"count":1,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product\/39103\/revisions"}],"predecessor-version":[{"id":39104,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product\/39103\/revisions\/39104"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/media\/35294"}],"wp:attachment":[{"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/media?parent=39103"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product_brand?post=39103"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product_cat?post=39103"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product_tag?post=39103"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}