{"id":39028,"date":"2026-07-27T16:34:22","date_gmt":"2026-07-27T14:34:22","guid":{"rendered":"https:\/\/tsecengineering.shop\/shop\/reballing-spheres-low-temp-040mm\/"},"modified":"2026-10-19T17:09:52","modified_gmt":"2026-10-19T15:09:52","slug":"reballing-spheres-low-temp-040mm","status":"publish","type":"product","link":"https:\/\/tsecengineering.shop\/en\/shop\/reballing-spheres-low-temp-040mm\/","title":{"rendered":"Sn42Bi57.6Ag0.4 BGA soldering and reballing spheres \u00d8 0.40mm 25,000pcs"},"content":{"rendered":"<p data-pm-slice=\"1 1 []\"><strong>Sn42\/Bi57.6\/Ag0.4 solder and reballing spheres<\/strong> are lead-free BGA spheres in <strong>Tin\/Bismuth\/Silver<\/strong> alloy, designed for soldering, reballing, and repair operations on electronic components requiring a reduced process temperature.<\/p>\n<p data-pm-slice=\"1 1 []\">The sphere diameter is <strong>0.40 mm \/ 0.016&#8243;<\/strong>, suitable for reballing operations on compatible BGA components. The <strong>Sn42\/Bi57.6\/Ag0.4<\/strong> alloy has a melting point of <strong>138 \u00b0C<\/strong>, significantly lower than common traditional alloys, and allows for limiting thermal stress on particularly delicate components and printed circuit boards. <\/p>\n<p>The product is <strong>lead-free<\/strong>, compliant with <strong>RoHS 3<\/strong> and <strong>REACH<\/strong> directives, and is supplied in a jar of approximately <strong>25,000 spheres<\/strong>, counted by weight.<\/p>\n<h4 class=\"isSelectedEnd\">Ideal for:<\/h4>\n<ul>\n<li>Low temperature BGA reballing<\/li>\n<li>Soldering of heat-sensitive BGA components<\/li>\n<li>Precision electronic repairs<\/li>\n<li>Rework on electronic boards<\/li>\n<li>Reduction of thermal stress on PCB and components<\/li>\n<li>Electronics labs and technical service centers<\/li>\n<li>Lead-free applications with Sn42\/Bi57.6\/Ag0.4 alloy<\/li>\n<\/ul>\n<table>\n<tbody>\n<tr>\n<th>Feature<\/th>\n<th>Description<\/th>\n<\/tr>\n<tr>\n<td>Product code<\/td>\n<td>SLD-SPH-SNBIAG-040<\/td>\n<\/tr>\n<tr>\n<td>Product type<\/td>\n<td>Low temperature BGA solder and reballing spheres<\/td>\n<\/tr>\n<tr>\n<td>Alloy<\/td>\n<td>Tin\/Bismuth\/Silver Sn42\/Bi57.6\/Ag0.4<\/td>\n<\/tr>\n<tr>\n<td>Composition<\/td>\n<td>42% Tin \/ 57.6% Bismuth \/ 0.4% Silver<\/td>\n<\/tr>\n<tr>\n<td>Sphere diameter<\/td>\n<td>0.40 mm \/ 0.016&#8243;<\/td>\n<\/tr>\n<tr>\n<td>Quantity<\/td>\n<td>Approximately 25,000 spheres<\/td>\n<\/tr>\n<tr>\n<td>Counting method<\/td>\n<td>Counted by weight<\/td>\n<\/tr>\n<tr>\n<td>Melting point<\/td>\n<td>138 \u00b0C \/ 281 \u00b0F<\/td>\n<\/tr>\n<tr>\n<td>Lead-free<\/td>\n<td>Yes<\/td>\n<\/tr>\n<tr>\n<td>Compliance<\/td>\n<td>RoHS 3 and REACH<\/td>\n<\/tr>\n<tr>\n<td>Packaging<\/td>\n<td>Jar<\/td>\n<\/tr>\n<tr>\n<td>Shelf life<\/td>\n<td>&gt; months<\/td>\n<\/tr>\n<tr>\n<td>Transport<\/td>\n<td>No specific restrictions<\/td>\n<\/tr>\n<tr>\n<td>Recommended applications<\/td>\n<td>Low temperature BGA reballing, BGA soldering, rework and precision electronic repairs<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<p>&nbsp;<\/p>\n<p>&nbsp;<\/p>\n","protected":false},"excerpt":{"rendered":"<p data-pm-slice=\"1 1 []\">Lead-free BGA soldering and reballing spheres in Tin\/Bismuth\/Silver Sn42\/Bi57.6\/Ag0.4 alloy, diameter 0.40 mm \/ 0.016&#8243;, melting point 138 \u00b0C. Supplied in a jar of approx. 25,000 spheres, counted by weight. RoHS 3 and REACH compliant.  <\/p>\n<h2><\/h2>\n<h2><\/h2>\n<h2><\/h2>\n","protected":false},"featured_media":35916,"comment_status":"open","ping_status":"closed","template":"","meta":[],"product_brand":[],"product_cat":[1871,1867,1869],"product_tag":[2261,2338,2333,2337,2357,2262,2332,2356,2339,2334,2343],"class_list":["post-39028","product","type-product","status-publish","has-post-thumbnail","product_cat-bga-reballing","product_cat-soldering-rework","product_cat-welding-consumables","product_tag-bga-balls","product_tag-bga-reballing-spheres","product_tag-electronic-soldering","product_tag-lead-free","product_tag-low-temperature","product_tag-reballing","product_tag-rework-pcb","product_tag-sn42bi57-6ag0-4","product_tag-solder-spheres","product_tag-soldering-consumables","product_tag-tin-silver-copper-2","pa_flt-soldering-alloy-sn42-bi576ag04-low-temp","pa_flt-soldering-product-typ-bga-solder-spheres","first","onbackorder","taxable","shipping-taxable","purchasable","product-type-simple"],"_links":{"self":[{"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product\/39028","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/comments?post=39028"}],"version-history":[{"count":0,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product\/39028\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/media\/35916"}],"wp:attachment":[{"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/media?parent=39028"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product_brand?post=39028"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product_cat?post=39028"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product_tag?post=39028"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}