The BeM FIX BEMFIX-DIM-003 template enables correct positioning of the Samsung K9F5608U0D NAND memory during repair and rework operations on Blue&Me units based on Xilinx XC3S400.<\/p>\n
The template is designed for components with dimensions of 9 \u00d7 11 mm and facilitates correct alignment of the memory on the PCB before soldering.<\/p>\n
The template is designed for:<\/p>\n
Before use, always verify the complete memory code and the actual package dimensions installed on the board.<\/p>\n
The template is made of stainless steel, a material suitable for professional microsoldering and rework operations.<\/p>\n
Key features include:<\/p>\n
The template can be used during:<\/p>\n
Position the template on the PCB, aligning the opening with the NAND memory footprint.<\/p>\n
Insert the component into the template, verify correct pin 1 orientation, and proceed with soldering using the appropriate rework technique.<\/p>\n
The template only facilitates component positioning and does not replace cleaning, preparation, reballing, or soldering operations.<\/p>\n
Watch the tutorial on YouTube<\/a><\/p>\nTechnical Specifications<\/h3>\n
| Feature<\/th>\n | Value<\/th>\n<\/tr>\n | ||||
|---|---|---|---|---|---|
| Product code<\/td>\n | BEMFIX-DIM-003<\/td>\n<\/tr>\n | ||||
| Application<\/td>\n | Blue&Me units<\/td>\n<\/tr>\n | ||||
| Associated platform<\/td>\n | Xilinx XC3S400<\/td>\n<\/tr>\n | ||||
| Compatible memory<\/td>\n | Samsung K9F5608U0D<\/td>\n<\/tr>\n | ||||
| Package size<\/td>\n | 9 \u00d7 11 mm<\/td>\n<\/tr>\n | ||||
| Material<\/td>\n | Stainless steel<\/td>\n<\/tr>\n | ||||
| Properties<\/td>\n | Non-magnetic, acid-resistant<\/td>\n<\/tr>\n | ||||
| Use<\/td>\n | NAND positioning during rework<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\nPackage Contents<\/h3>\n
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