{"id":38693,"date":"2026-07-31T16:44:47","date_gmt":"2026-07-31T14:44:47","guid":{"rendered":"https:\/\/tsecengineering.shop\/shop\/stencil-reballing-vfbga63-htx90\/"},"modified":"2026-10-12T16:46:55","modified_gmt":"2026-10-12T14:46:55","slug":"stencil-reballing-vfbga63-htx90","status":"publish","type":"product","link":"https:\/\/tsecengineering.shop\/en\/shop\/stencil-reballing-vfbga63-htx90\/","title":{"rendered":"VFBGA63 Reballing Stencil for HTX90 Support, 0.25 mm"},"content":{"rendered":"<h4 class=\"isSelectedEnd\">VFBGA63 Stencil for BGA Reballing<\/h4>\n<p class=\"isSelectedEnd\">The BeM FIX BEMFIX-STNL-VFBGA63 stencil is designed for reballing components and memories in VFBGA63 package.<\/p>\n<p class=\"isSelectedEnd\">It allows correct distribution and positioning of solder balls on the component matrix, facilitating the restoration of BGA connections during repair and rework operations.<\/p>\n<h4 class=\"isSelectedEnd\">Compatible with HTX90 Support<\/h4>\n<p class=\"isSelectedEnd\">The stencil is designed to be used with the SLD-AID-HTX90 universal BGA reballing support.<\/p>\n<p class=\"isSelectedEnd\">The support&#8217;s magnetic fastening system allows the stencil to be quickly locked without using screws, keeping it correctly aligned with the component.<\/p>\n<h4 class=\"isSelectedEnd\">High-Precision Laser Production<\/h4>\n<p class=\"isSelectedEnd\">The stencil openings are made using laser processing with high dimensional accuracy.<\/p>\n<p class=\"isSelectedEnd\">This process allows:<\/p>\n<ul data-spread=\"false\">\n<li>regular and uniform holes;<\/li>\n<li>correct positioning of the balls;<\/li>\n<li>high repeatability of operations;<\/li>\n<li>greater precision during reballing;<\/li>\n<li>better distribution of paste or solder balls.<\/li>\n<\/ul>\n<h4 class=\"isSelectedEnd\">Stainless Steel Structure<\/h4>\n<p class=\"isSelectedEnd\">The stencil is made of stainless steel with a thickness of 0.25 mm.<\/p>\n<p class=\"isSelectedEnd\">The material offers:<\/p>\n<ul data-spread=\"false\">\n<li>acid resistance;<\/li>\n<li>good dimensional stability;<\/li>\n<li>resistance to products used during rework;<\/li>\n<li>ease of cleaning;<\/li>\n<li>possibility of repeated use.<\/li>\n<\/ul>\n<h4 class=\"isSelectedEnd\">Applications<\/h4>\n<p class=\"isSelectedEnd\">The stencil can be used for:<\/p>\n<ul data-spread=\"false\">\n<li>reballing VFBGA63 memories;<\/li>\n<li>repair of Blue&#038;Me units;<\/li>\n<li>restoration of solder balls;<\/li>\n<li>replacement of NAND Flash memories;<\/li>\n<li>microsoldering and BGA rework operations.<\/li>\n<\/ul>\n<h4 class=\"isSelectedEnd\">Instructions for Use<\/h4>\n<ol start=\"1\" data-spread=\"false\">\n<li>Position the component in the HTX90 support.<\/li>\n<li>Center and lock the chip using the four clamps.<\/li>\n<li>Position the stencil over the component.<\/li>\n<li>Lock the stencil using the magnetic supports.<\/li>\n<li>Adjust the height so that the stencil adheres correctly to the chip surface.<\/li>\n<li>Apply the balls or solder paste.<\/li>\n<li>Carefully remove the stencil and proceed with heating.<\/li>\n<\/ol>\n<p><span style=\"color: #01529b;\"><strong><a style=\"color: #01529b;\" href=\"https:\/\/www.youtube.com\/shorts\/0Y2WOhRiVjw\" target=\"_blank\" rel=\"noopener\">Watch the reballing tutorial<\/a><\/strong><\/span><\/p>\n<h4 class=\"isSelectedEnd\">Technical Specifications<\/h4>\n<table>\n<tbody>\n<tr>\n<th>Feature<\/th>\n<th>Value<\/th>\n<\/tr>\n<tr>\n<td>Product Code<\/td>\n<td>BEMFIX-STNL-VFBGA63<\/td>\n<\/tr>\n<tr>\n<td>Compatible Package<\/td>\n<td>VFBGA63 \/ BGA63<\/td>\n<\/tr>\n<tr>\n<td>Application<\/td>\n<td>BGA Reballing<\/td>\n<\/tr>\n<tr>\n<td>Compatible Support<\/td>\n<td>SLD-AID-HTX90<\/td>\n<\/tr>\n<tr>\n<td>Material<\/td>\n<td>Stainless steel<\/td>\n<\/tr>\n<tr>\n<td>Thickness<\/td>\n<td>0.25 mm<\/td>\n<\/tr>\n<tr>\n<td>Production Method<\/td>\n<td>High-precision laser cutting<\/td>\n<\/tr>\n<tr>\n<td>Properties<\/td>\n<td>Acid resistant<\/td>\n<\/tr>\n<tr>\n<td>Use<\/td>\n<td>Application and positioning of solder balls<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h4 class=\"isSelectedEnd\">Important Information<\/h4>\n<p class=\"isSelectedEnd\">The product includes the stencil only.<\/p>\n<p class=\"isSelectedEnd\">The HTX90 support, BGA component, solder balls, flux, and other equipment possibly shown in the images are not included.<\/p>\n<p>Before use, verify that the component&#8217;s ball layout corresponds exactly to the stencil matrix.<\/p>\n","protected":false},"excerpt":{"rendered":"<p class=\"isSelectedEnd\">BeM FIX stencil for reballing memories in VFBGA63 package, designed for use with the HTX90 universal support.<\/p>\n<p>Made of acid-resistant stainless steel using high-precision laser cutting, with a thickness of 0.25 mm.<\/p>\n","protected":false},"featured_media":36267,"comment_status":"open","ping_status":"closed","template":"","meta":[],"product_brand":[],"product_cat":[1871,934,933,1867],"product_tag":[2220,2234,2263,952,2297,2270,948,2296,953],"class_list":["post-38693","product","type-product","status-publish","has-post-thumbnail","product_cat-bga-reballing","product_cat-bem-fix","product_cat-ecu-repairs","product_cat-soldering-rework","product_tag-bem-fix","product_tag-bga-reballing","product_tag-bga-stencil","product_tag-bga63","product_tag-htx90","product_tag-microsoldering","product_tag-nand-flash","product_tag-stainless-steel","product_tag-vfbga63","first","instock","taxable","shipping-taxable","purchasable","product-type-simple"],"_links":{"self":[{"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product\/38693","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/comments?post=38693"}],"version-history":[{"count":1,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product\/38693\/revisions"}],"predecessor-version":[{"id":38694,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product\/38693\/revisions\/38694"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/media\/36267"}],"wp:attachment":[{"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/media?parent=38693"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product_brand?post=38693"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product_cat?post=38693"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product_tag?post=38693"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}