{"id":38676,"date":"2026-08-05T12:21:00","date_gmt":"2026-08-05T10:21:00","guid":{"rendered":"https:\/\/tsecengineering.shop\/shop\/complete-reballing-kit-vfbga63\/"},"modified":"2026-10-12T16:46:40","modified_gmt":"2026-10-12T14:46:40","slug":"complete-reballing-kit-vfbga63","status":"publish","type":"product","link":"https:\/\/tsecengineering.shop\/en\/shop\/complete-reballing-kit-vfbga63\/","title":{"rendered":"Complete VFBGA63 reballing kit with Mini Hot Plate"},"content":{"rendered":"<p class=\"isSelectedEnd\">The kit includes the equipment and main consumables required to perform reballing on memories and devices in VFBGA63 packages.<\/p>\n<p class=\"isSelectedEnd\">It is a complete solution for electronics laboratories, automotive technicians, and specialized operators seeking a compact, ready-to-use station for preparing and restoring BGA connections.<\/p>\n<h4>Original MINIWARE MHP30 included<\/h4>\n<p class=\"isSelectedEnd\">The kit includes the original MINIWARE MHP30 preheating station, featuring a 30 \u00d7 30 mm heating plate and adjustable temperature from 100 \u00b0C to 350 \u00b0C.<\/p>\n<p class=\"isSelectedEnd\">The USB-C Power Delivery and compact dimensions allow the station to be used both in the laboratory and for off-site technical interventions.<\/p>\n<p class=\"isSelectedEnd\">With the included 65 W PD power supply, the plate reaches 300 \u00b0C in approximately 150 seconds, starting from an ambient temperature of about 26 \u00b0C.<\/p>\n<h4>HTX90 universal support<\/h4>\n<p class=\"isSelectedEnd\">The HTX90 support allows for component centering via four synchronized locking points.<\/p>\n<p class=\"isSelectedEnd\">The spiral rotating plate moves the clamps simultaneously, eliminating the need for individual adjustment and allowing for quick, uniform clamping.<\/p>\n<p class=\"isSelectedEnd\">The support is compatible with components from 4 \u00d7 4 mm up to 45 \u00d7 45 mm.<\/p>\n<h4>Magnetic stencil fixing<\/h4>\n<p class=\"isSelectedEnd\">The stencil is locked using magnetic clamps, without the use of screws.<\/p>\n<p class=\"isSelectedEnd\">The adjustment knobs located near the corners allow for the regulation of the stencil height relative to the component surface, facilitating correct ball positioning.<\/p>\n<p class=\"isSelectedEnd\">The HTX90 support can use 80 \u00d7 80 mm and 90 \u00d7 90 mm stencils.<\/p>\n<h4>Dedicated VFBGA63 stencil<\/h4>\n<p class=\"isSelectedEnd\">The kit includes the BEMFIX-STNL-VFBGA63 stencil, made of stainless steel using high-precision laser processing.<\/p>\n<p class=\"isSelectedEnd\">The 0.25 mm thickness and dedicated matrix allow for the correct distribution of solder balls on compatible VFBGA63 devices.<\/p>\n<p class=\"isSelectedEnd\">Before processing, it is necessary to verify that the component&#8217;s ball layout exactly matches the stencil matrix.<\/p>\n<h4>Consumables included<\/h4>\n<p class=\"isSelectedEnd\">The kit also includes the main consumables needed to prepare the component and perform the process:<\/p>\n<ul data-spread=\"false\">\n<li>flux syringe;<\/li>\n<li>solder balls;<\/li>\n<li>high-temperature resistant polyimide tape;<\/li>\n<li>desoldering wick;<\/li>\n<li>precision tweezers.<\/li>\n<\/ul>\n<p class=\"isSelectedEnd\">The composition allows you to start working without having to purchase essential materials separately.<\/p>\n<h4>Applications<\/h4>\n<p class=\"isSelectedEnd\">The kit can be used for:<\/p>\n<ul data-spread=\"false\">\n<li>VFBGA63 memory reballing;<\/li>\n<li>restoration of BGA connections;<\/li>\n<li>NAND Flash memory processing;<\/li>\n<li>Blue&#038;Me unit repair;<\/li>\n<li>electronic component rework;<\/li>\n<li>preparation of previously desoldered memories;<\/li>\n<li>soldering and desoldering of small SMD components;<\/li>\n<li>preheating of compact printed circuit boards.<\/li>\n<\/ul>\n<h4>Kit composition<\/h4>\n<table>\n<tbody>\n<tr>\n<th>Component<\/th>\n<th>Quantity<\/th>\n<\/tr>\n<tr>\n<td>MINIWARE MHP30 Controller<\/td>\n<td>1<\/td>\n<\/tr>\n<tr>\n<td>Heating plate with nano-ceramic surface<\/td>\n<td>1<\/td>\n<\/tr>\n<tr>\n<td>65 W USB-C Power Delivery power supply<\/td>\n<td>1<\/td>\n<\/tr>\n<tr>\n<td>USB Type-C \/ Type-C cable<\/td>\n<td>1<\/td>\n<\/tr>\n<tr>\n<td>HTX90 universal reballing support<\/td>\n<td>1<\/td>\n<\/tr>\n<tr>\n<td>Magnetic stencil clamps<\/td>\n<td>Set included<\/td>\n<\/tr>\n<tr>\n<td>VFBGA63 Stencil BEMFIX-STNL-VFBGA63<\/td>\n<td>1<\/td>\n<\/tr>\n<tr>\n<td>10 cc flux syringe<\/td>\n<td>1<\/td>\n<\/tr>\n<tr>\n<td>Solder balls for VFBGA63<\/td>\n<td>1 pack<\/td>\n<\/tr>\n<tr>\n<td>High-temperature resistant polyimide tape<\/td>\n<td>1<\/td>\n<\/tr>\n<tr>\n<td>Desoldering wick<\/td>\n<td>1<\/td>\n<\/tr>\n<tr>\n<td>Precision tweezers<\/td>\n<td>1<\/td>\n<\/tr>\n<tr>\n<td>MINIWARE safety instructions<\/td>\n<td>1<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h4>MINIWARE MHP30 Specifications<\/h4>\n<table>\n<tbody>\n<tr>\n<td>Feature<\/td>\n<td>Value<\/td>\n<\/tr>\n<tr>\n<td>Model<\/td>\n<td>MINIWARE MHP30<\/td>\n<\/tr>\n<tr>\n<td>Heating area<\/td>\n<td>30 \u00d7 30 mm<\/td>\n<\/tr>\n<tr>\n<td>Temperature range<\/td>\n<td>100\u2013350 \u00b0C<\/td>\n<\/tr>\n<tr>\n<td>Temperature stability<\/td>\n<td>\u00b13%<\/td>\n<\/tr>\n<tr>\n<td>Maximum power<\/td>\n<td>60 W<\/td>\n<\/tr>\n<tr>\n<td>Power supply<\/td>\n<td>USB-C Power Delivery<\/td>\n<\/tr>\n<tr>\n<td>Power supply included<\/td>\n<td>PD 65 W<\/td>\n<\/tr>\n<tr>\n<td>Display<\/td>\n<td>OLED<\/td>\n<\/tr>\n<tr>\n<td>Thermal indicator<\/td>\n<td>True Color LED<\/td>\n<\/tr>\n<tr>\n<td>Firmware update<\/td>\n<td>Via USB-C<\/td>\n<\/tr>\n<tr>\n<td>Controller and plate weight<\/td>\n<td>82 g<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h4>HTX90 Support Specifications<\/h4>\n<table>\n<tbody>\n<tr>\n<td>Feature<\/td>\n<td>Value<\/td>\n<\/tr>\n<tr>\n<td>Centering system<\/td>\n<td>Automatic four-point<\/td>\n<\/tr>\n<tr>\n<td>Minimum component size<\/td>\n<td>4 \u00d7 4 mm<\/td>\n<\/tr>\n<tr>\n<td>Maximum component size<\/td>\n<td>45 \u00d7 45 mm<\/td>\n<\/tr>\n<tr>\n<td>Stencil locking<\/td>\n<td>Magnetic<\/td>\n<\/tr>\n<tr>\n<td>Compatible stencils<\/td>\n<td>80 \u00d7 80 mm, 90 \u00d7 90 mm<\/td>\n<\/tr>\n<tr>\n<td>Frame material<\/td>\n<td>Aluminum alloy<\/td>\n<\/tr>\n<tr>\n<td>Stencil height adjustment<\/td>\n<td>Adjustable knobs<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<h4>General Operating Procedure<\/h4>\n<ol start=\"1\" data-spread=\"false\">\n<li>Thoroughly clean the component and remove solder residues.<\/li>\n<li>Lock the component in the HTX90 support.<\/li>\n<li>Select and position the VFBGA63 stencil.<\/li>\n<li>Adjust the stencil height using the adjustment knobs.<\/li>\n<li>Apply flux and distribute the solder balls.<\/li>\n<li>Remove excess balls and verify the correct filling of the matrix.<\/li>\n<li>Heat the component using the MINIWARE MHP30.<\/li>\n<li>Wait for complete melting and correct settling of the balls.<\/li>\n<li>Allow the component to cool without moving it.<\/li>\n<li>Remove the stencil and check the result under a microscope.<\/li>\n<\/ol>\n<h4>Video tutorial<\/h4>\n<p class=\"isSelectedEnd\">Watch the short tutorial dedicated to the reballing procedure:<\/p>\n<p class=\"isSelectedEnd\"><a href=\"https:\/\/www.youtube.com\/shorts\/0Y2WOhRiVjw\" target=\"_blank\" rel=\"noopener\">Watch the 5-minute reballing tutorial<\/a><\/p>\n<h4>Original MINIWARE product<\/h4>\n<p class=\"isSelectedEnd\">The preheating station included in the kit is an original MINIWARE MHP30.<\/p>\n<p class=\"isSelectedEnd\">The original product guarantees correct compatibility with firmware updates, accessories, and the technical specifications declared by the manufacturer.<\/p>\n<h4>Safety Warnings<\/h4>\n<p class=\"isSelectedEnd\">The kit is intended for operators with experience in micro-soldering and BGA rework.<\/p>\n<p class=\"isSelectedEnd\">The heating plate can reach a temperature of 350 \u00b0C. Do not touch the surface, the metal bracket, or the component during processing and before complete cooling. <\/p>\n<p class=\"isSelectedEnd\">Use the kit in a ventilated environment, on a fireproof surface, and away from flammable materials.<\/p>\n<p class=\"isSelectedEnd\">Do not leave the station powered and unattended.<\/p>\n<p>Before processing, always verify the compatibility between the component, stencil, ball diameter, and the thermal profile used.<\/p>\n","protected":false},"excerpt":{"rendered":"<p class=\"isSelectedEnd\">Complete, ready-to-use kit for reballing memories and devices in VFBGA63 packages.<\/p>\n<p>Includes the original MINIWARE MHP30 preheating station with 65 W USB-C PD power supply, HTX90 universal support, VFBGA63 stencil, and consumables required to start processing.<\/p>\n","protected":false},"featured_media":36468,"comment_status":"open","ping_status":"closed","template":"","meta":[],"product_brand":[],"product_cat":[934,933],"product_tag":[2269,2265,2261,2263,2268,2267,2264,2266,2262,953],"class_list":["post-38676","product","type-product","status-publish","has-post-thumbnail","product_cat-bem-fix","product_cat-ecu-repairs","product_tag-automotive-electronics","product_tag-bga","product_tag-bga-balls","product_tag-bga-stencil","product_tag-electronics-repair","product_tag-flux","product_tag-mini-hot-plate","product_tag-nand","product_tag-reballing","product_tag-vfbga63","first","instock","sale","taxable","shipping-taxable","purchasable","product-type-woosb"],"_links":{"self":[{"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product\/38676","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/types\/product"}],"replies":[{"embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/comments?post=38676"}],"version-history":[{"count":1,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product\/38676\/revisions"}],"predecessor-version":[{"id":38677,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product\/38676\/revisions\/38677"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/media\/36468"}],"wp:attachment":[{"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/media?parent=38676"}],"wp:term":[{"taxonomy":"product_brand","embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product_brand?post=38676"},{"taxonomy":"product_cat","embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product_cat?post=38676"},{"taxonomy":"product_tag","embeddable":true,"href":"https:\/\/tsecengineering.shop\/en\/wp-json\/wp\/v2\/product_tag?post=38676"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}